551. Warum sind Mikroelektroniker noch nicht biokompatibel? Herausforderungen und Potentiale von mikroelektronischen Chips in Life Science Anwendungen   Georg Gläser, Alexander Hofmann 19. Heiligenstädter Kolloquium, 24.-26. September 2018  

  552. NFC Compatible Passive HF RFID Transponder for Wireless Bio-Sensing Applications   Muralikrishna Sathyamurthy, Sylvo Jäger 19. Heiligenstädter Kolloquium, 24.-26. September 2018  

  553. Modeling Pitch Perception With an Active Auditory Model Extended by Octopus Cells   Tamas Harczos, Frank Markus Klefenz Front. Neurosci., 25 September 2018, Sec. Neuromorphic Engineering, Volume 12 - 2018, DOI: https://doi.org/10.3389/fnins.2018.00660  

  554. Mittels neuer Denk- und Arbeitsweise neue Produkte, Dienste und Geschäftsmodelle entwickeln   Jörg Weber, Mittelstand 4.0-Regionalkonferenz, „Arbeit 4.0 konkret – Wie verändert die Digitalisierung unsere Arbeitswelt?“, Workshop „Design Thinking – eine praktische Einführung, 18. September 2018, Augustinerkloster, Erfurt  

  555. Effizientes Design und Layout von 3D Beschleunigungssensoren mittels automatisierter Synthese   Steffen Michael, Maria Kellner Ralf Sommer Analog 2018, 16. GMM/ITG-Fachtagung, 12.-14. September 2018, München-Neubiberg  

  556. Design of Quasi-synchronous Finite State Machines Using a Local On-demand Clocking Approach   Athanasios Gatzastras, Dominik Wrana Tobias Wolfer Georg Gläser Benjamin Saft Eric Schäfer Eckhard Hennig Analog 2018, 16. GMM/ITG-Fachtagung, München-Neubiberg, 12-14 September 2018, Proceedings: https://www.vde-verlag.de/proceedings-en/454754003.html  

  557. Design and Performance of Power Amplifier Integration with BAW Filter on a Silicon-Ceramic Composite and Standard Epoxy/Glass Substrate   Vikrant Chauhan, Wilfried Wandji Xuejiao Peng Victor Silva Cortes Astrid Frank Michael Fischer Uwe Stehr Robert Weigel Amelie Hagelauer 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Ann Arbor, MI, 2018, 16-18 July, pp. 1-3. DOI: https://doi.org/10.1109/IMWS-AMP.2018.8457140  

  558. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors   Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic  

  559. Impact Rating of Layout Parasitics in Mixed-Signal Circuits: Finding a Needle in a Haystack   Georg Gläser, Martin Grabmann Dirk Nuernbergk 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Prague, 2-5 July 2018, pp. 149-152. DOI: https://doi.org/10.1109/SMACD.2018.8434844  

  560. A Distributed Sensor Network for Monitoring Noise Level and Noise Sources in Urban Environments   Jakob Abeßer, Robert Gräfe Christian Kühn Tobias Clauß Hanna Lukashevich Marco Götze Stephanie Kühnlenz 2018 IEEE 6th International Conference on Future Internet of Things and Cloud (FiCloud), Barcelona, 6-8 August 2018, pp. 318-324. DOI: https://doi.org/10.1109/FiCloud.2018.00053