561. Towards rapid on-site measurement of Staphylococcus aureus contamination by aptasensors implemented with microelectronics   Peggy Reich, Dieter Frense Uwe Pliquett Dieter Beckmann Smart Sensors 2018, Smart Sensors - mechanistic and data driven modelling, 1-2 October 2018, DECHEMA-Haus, Frankfurt/Main  

  562. Warum sind Mikroelektroniker noch nicht biokompatibel? Herausforderungen und Potentiale von mikroelektronischen Chips in Life Science Anwendungen   Georg Gläser, Alexander Hofmann 19. Heiligenstädter Kolloquium, 24.-26. September 2018  

  563. NFC Compatible Passive HF RFID Transponder for Wireless Bio-Sensing Applications   Muralikrishna Sathyamurthy, Sylvo Jäger 19. Heiligenstädter Kolloquium, 24.-26. September 2018  

  564. Modeling Pitch Perception With an Active Auditory Model Extended by Octopus Cells   Tamas Harczos, Frank Markus Klefenz Front. Neurosci., 25 September 2018, Sec. Neuromorphic Engineering, Volume 12 - 2018, DOI: https://doi.org/10.3389/fnins.2018.00660  

  565. Mittels neuer Denk- und Arbeitsweise neue Produkte, Dienste und Geschäftsmodelle entwickeln   Jörg Weber, Mittelstand 4.0-Regionalkonferenz, „Arbeit 4.0 konkret – Wie verändert die Digitalisierung unsere Arbeitswelt?“, Workshop „Design Thinking – eine praktische Einführung, 18. September 2018, Augustinerkloster, Erfurt  

  566. Effizientes Design und Layout von 3D Beschleunigungssensoren mittels automatisierter Synthese   Steffen Michael, Maria Kellner Ralf Sommer Analog 2018, 16. GMM/ITG-Fachtagung, 12.-14. September 2018, München-Neubiberg  

  567. Design of Quasi-synchronous Finite State Machines Using a Local On-demand Clocking Approach   Athanasios Gatzastras, Dominik Wrana Tobias Wolfer Georg Gläser Benjamin Saft Eric Schäfer Eckhard Hennig Analog 2018, 16. GMM/ITG-Fachtagung, München-Neubiberg, 12-14 September 2018, Proceedings: https://www.vde-verlag.de/proceedings-en/454754003.html  

  568. Design and Performance of Power Amplifier Integration with BAW Filter on a Silicon-Ceramic Composite and Standard Epoxy/Glass Substrate   Vikrant Chauhan, Wilfried Wandji Xuejiao Peng Victor Silva Cortes Astrid Frank Michael Fischer Uwe Stehr Robert Weigel Amelie Hagelauer 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Ann Arbor, MI, 2018, 16-18 July, pp. 1-3. DOI: https://doi.org/10.1109/IMWS-AMP.2018.8457140  

  569. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors   Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic  

  570. Impact Rating of Layout Parasitics in Mixed-Signal Circuits: Finding a Needle in a Haystack   Georg Gläser, Martin Grabmann Dirk Nuernbergk 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Prague, 2-5 July 2018, pp. 149-152. DOI: https://doi.org/10.1109/SMACD.2018.8434844