1722 results
Reference
  291. Kontinuierliche Signalanalyse für Ethernet-Kabel  
Sebastian Uziel, elmug4future, Technologiekonferenz, 21. - 22. September 2021, ComCenter Brühl, Erfurt  
Reference
  292. K4PNP+Z  
IMMS developed actuators to position objects in planes with diameters up to 200 mm and a vertical stroke of 25 mm with nanometre precision.  
Reference
  293. Comparing BLE and NB-IoT as Communication Options for Smart Viticulture IoT Applications  
Silvia Krug, Sebastian Miethe Tino Hutschenreuther 2021 IEEE Sensors Applications Symposium (SAS), SOI: https://doi.org/10.1109/SAS51076.2021.9530069, 23 - 25 August 2021, virtual conference  
Reference
  294. VE-VIDES  
Against hacker attacks: Innovative chip architectures, modelling and verification methods for trustworthy electronics  
Reference
  295. Schallpegel im Ultraschallbereich  
Peter Holstein, Nicki Bader Hans-Joachim Münch Matthias Domke Udo Wagner Tino Hutschenreuther Sebastian Uziel DAGA 2021 - 47. Jahrestagung für Akustik, 15. - 18. August 2021, Wien  
Reference
  296. EdgeCam  
In EdgeCam, IMMS provides the smart communications between cameras of a virtual safety zone for truck cranes.  
Reference
  297. Tip‑ and Laser‑based 3D Nanofabrication in Extended Macroscopic Working Areas  
Ingo Ortlepp, Thomas Fröhlich, Roland Füßl et al., Nanomanufacturing and Metrology 4, 132–148 (2021). DOI: https://doi.org/10.1007/s41871-021-00110-w  
Reference
  298. Impact of Input Data on Intelligence Partitioning Decisions for IoT Smart Camera Nodes  
Isaac Sánchez Leal, Irida Shallari Silvia Krug Axel Jantsch Mattias O’Nils Electronics 2021, 10, 1898. DOI: https://doi.org/10.3390/electronics10161898  
Reference
  299. Mikroelektromechanischer Beschleunigungssensor  
Steffen Michael, DE 10 2020 119 371 B3  
Reference
  300. Trash or Treasure? Machine-learning based PCB layout anomaly detection with AnoPCB  
Henning Franke, Paul Kucera Julian Kuners Tom Reinhold Martin Grabmann Patrick Mäder Marco Seeland Georg Gläser 2021 17th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Proceedings in: 423 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom, ISBN 978-3-8007-5588-2, E-Book: ISBN 978-3-8007-5589-9, https://ieeexplore.ieee.org/document/9547913, 19 - 22 July 2021, Erfurt, Germany, online  
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