Core topic Modular and mobile test systems
The set-up of test solutions is an integral part of all application developments. This always involves striving for the highest possible test coverage of the technical parameters. Yet this goal often collides with the available development time for test systems. The approach of a freely configurable modular test system is a good compromise for many applications.
Our research aims to design modular test systems that can be flexibly and quickly adapted to new challenges by using optimised functional test units. This concept can be transferred to many fields of application. At IMMS, it is currently used for wafer test and application set-ups for in-vitro diagnostics, among other things.
Contact
Contact
Dipl.-Ing. Michael Meister
Head of Industrial Electronics and Measurement Technology
michael.meister(at)imms.de+49 (0) 3677 874 93 20
Michael Meister is your contact for testing services, the development of test methodologies, and long-term measurements. He answers your questions on Modular and mobile test systems that we develop in our research in Smart distributed measurement and test systems as well as about testing and characterisation of integrated sensor systems. He is responsible for the test equipment at IMMS and will support you in the validation of ASIC and MEMS developments.
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Quantum Hub Thüringen
For quantum technology from Thüringen, Germany, IMMS is researching CMOS-based single-photon detectors.
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ViroGraph
A novel technology platform with graphene-based field-effect transistor for the detection of SARS-CoV-2 is being developed
Project
MEDIKIT
IMMS has developed a chip for mobile diagnostic systems for the early detection of diseases using time-resolved fluorescence measurements.
Project
INSPECT
We have developed a CMOS biochip with which the prostate-specific antigen can be quantitatively detected. The chip achieves the specifications required for clinical PSA tests according to Rili-BÄK for early cancer detection.
Reference
Prof. Dr. Peter Holstein, SONOTEC GmbH
“IMMS has designed the digital components of the hardware to be used in our new digital ultrasonic testing device. The signal processing performance achieved is largely based on FPGA technology, a field in which IMMS has excellent references. Our joint work with IMMS went off perfectly.”
Reference
René Heidl, Indu-Sol
“IMMS with its many years of experience in energy-autonomous systems and in developing integrated hardware and software complemented our own work perfectly and developed us a battery-operated current clamp for us. We are more than happy with the product, which is now being mass-produced and is a valuable addition to our range.”
Vibrometry in the Field of MEMS – Application Examples from Stress to Quality Factor Identification
Steffen Michael1.CiS-Workshop "Simulation und Design", 26.09.2023, Erfurt, Germany
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.Characterizing Dynamics of MEMS Devices on Wafer Level Using Optical Measurement Techniques
Sebastian Giessmann1. Steffen Michael2. Eric Lawrence3. Dr. Heinrich Steger4.Commercial Micro Manufacturing International Magazine (CMM Magazine), 08-2023, VOL 16 NO. 3, pp. 30-39
1MPI Corporation. 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany. 3Polytec, Inc.. 4Polytec GmbH.A compact pump-probe optically pumped magnetometer system
Theo Scholtes1. Jannis Grixa1. Jakob Hampel2. Andreas Chwala1. Frank Bauer1. Ronny Stolz1.16th Photonics Workshop, 12th - 15th March 2023, Kopaonik, Serbien
1Leibniz IPHT, Albert-Einstein-Strasse 9, 07745 Jena, Germany. 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.Trash or Treasure? Machine-learning based PCB layout anomaly detection with AnoPCB
Henning Franke1. Paul Kucera1. Julian Kuners1. Tom Reinhold2. Martin Grabmann2. Patrick Mäder1. Marco Seeland1. Georg Gläser2.2021 17th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Proceedings in: 423 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom, ISBN 978-3-8007-5588-2, E-Book: ISBN 978-3-8007-5589-9, ieeexplore.ieee.org/document/9547913, 19 - 22 July 2021, Erfurt, Germany, online
1Technische Universität Ilmenau, Germany. 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.
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