Research field Integrated sensor systems
In the research field “Integrated sensor systems”, we investigate miniaturised systems manufactured in semiconductor technology consisting of microelectronic and/or microelectromechanical components for sensors applications, as well as methods to design these highly complex systems efficiently and safely.
Integrated sensor systems connect the analog with the digital world:
Electrical, mechanical and optical parameters can be directly detected, amplified, digitised and transmitted on these silicon chips with an edge length of just a few millimetres. They are mobile, energy-efficient, precise and powerful and therefore represent the key technology for the Internet-of-Things (IoT). Functionalised chip surfaces can be used to measure additional physical as well as chemical and biological parameters. With integrated sensor systems, structural sizes in the µm range can be achieved and thus properties can also be detected on a molecular scale, such as in the sequencing of DNA.
New applications and commercial technologies
We aim to pioneer new applications through functional integration and miniaturisation.
The goal of our research is always industrial exploitation. We therefore focus on system design with commercial semiconductor technology. Large quantities can be used here to achieve competitive and cost-effective solutions. In addition, IP protection and trustworthiness are strengthened.
Integrated sensor systems are incorporated into solutions for all target markets of IMMS. In the lead applications of sensor systems for in-vitro diagnostics and RFID sensors, we focus on the use of integrated sensor systems in life sciences as well as in automation technology and Industry 4.0 target markets.
Core topics in this research field
Core topic
CMOS-based biosensors
We are researching CMOS-integrated transducers and their interaction with biological receptors. They offer the potential for precise, digital and cost-effective point-of-care tests and allow properties to be recorded on a molecular scale.
Core topic
ULP sensor systems
We research and develop ultra-low-power (ULP) sensor systems that require very little power and have integrated energy management components. Our goal is to use them to open up new applications for the Internet of Things.
Core topic
AI-based design and test automation
We are researching to use AI to make the development process of integrated sensor systems safer and more cost-effective. AI can help developers in the process to avoid errors and apply informal knowledge in an automated way.
Contact
Contact
Eric Schäfer, M. Sc.
Head of Microelectronics / Branch Office Erfurt
eric.schaefer(at)imms.de+49 (0) 361 663 25 35
Eric Schäfer and his team research Integrated sensor systems, especially CMOS-based biosensors, ULP sensor systems and AI-based design and test automation. The results are being incorporated into research on the lead applications Sensor systems for in-vitro diagnostics and RFID sensor technology. It will assist you with services for the development of Integrated circuits and with IC design methods.
Related content
Project
SensInt
The IMMS is developing a CMOS image sensor for time-resolved fluorescence detection for direct integration into microfluidic cartridges using 3D screen printing.
Project
FluoResYst
The IMMS is developing a SPAD-based sensor for time-resolved readout of fluorescence-labelled DNA microarrays.
Project
StorAIge
We are researching the use of ultra-low power embedded memories in wireless sensor front-end ICs for monitoring the condition of wind turbines and individual plants produced in greenhouses.
Project
KODIAK
IMMS researches image sensors for chemiluminescence assays with Thuringian industry and institutes from Erfurt-Südost and Jena
Reference
Dr. Katja Nicolai, IL Metronic
“From my point of view, the numerous outcomes, many of them already validated by demonstrators, speak for themselves. These wireless solutions with their energy self-sufficiency are blazing the trail for quick, cheap and easy retrofitting. I envisage their use not only in manufacturing processes but in other areas such as transport and logistics.”
Reference
Sylvo Jäger, microsensys GmbH
“For a number of years now, we have been appreciative of our cooperation with IMMS. The Institute is for us an innovative technological partner in our own geographical area, capable of supporting us not only in implementing various development tasks in the ASIC design field but also of coordinating joint projects which benefit from industrial and public subsidy.”
Reference
Dr. Friedrich Scholz, Senova
“IMMS demonstrated great commitment in responding to the huge challenges on the development of the point-of-care test. Our experience demonstrates that IMMS application-oriented analyses, understands and models the biochemical processes. Furthermore, the colleagues implement the specifications with their integrated system design and are flexible in adapting the systems as necessary.”
Reference
Khalid Ishaque, Pixium Vision
“IMMS delivered a vital contribution to our goal of restoring the sight of visually impaired people. The IMMS developed an application specific integrated circuit (ASIC) used in our intraocular implant which we are using in our most recent systems as well.”
Artificially Intelligent EDA
Georg Gläser1.CiS-Workshop "Simulation und Design", 26.09.2023, Erfurt, Germany
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.Vibrometry in the Field of MEMS – Application Examples from Stress to Quality Factor Identification
Steffen Michael1.CiS-Workshop "Simulation und Design", 26.09.2023, Erfurt, Germany
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.IC-Entwicklung: Effizientere Simulation mit KI-basierter Modellfehlerschätzung
Henning Siemen1. Martin Grabmann1. Eric Schäfer1. Georg Gläser1.Elektronik, Ausgabe 17-18/2023, 23. August 2023, Seite 66-69. wfm-publish.blaetterkatalog.de/frontend/mvc/catalog/by-name/ELE
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.Hot Fuzz: Assisting verification by fuzz testing microelectronic hardware
Henning Siemen1. Jonas Lienke1. Georg Gläser1.2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2023, 03 - 05 July 2023, Funchal, Madeira, Portugal, pp. 1-4, DOI: doi.org/10.1109/SMACD58065.2023.10192176
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany..
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Service for R&D
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We offer the design and realisation of application-specific integrated circuits (ASICs) in CMOS, BiCMOS and SOI technologies. We achieve well-performing ASICs with our first runs (first-time right silicon).
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Lead application
Sensor systems for in-vitro diagnostics
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