Test and characterisation

Together with you, we develop and optimise test setups to determine the parameters of your circuits and components accurately and quickly.

• Development of test methods
• Modular test platforms
• Development of application-specific test equipment
• Load board development for test platforms in production test
• Development of probe cards for wafer test

We support you in creating and optimising automatic test sequences to determine trustworthy and reproducible measurement data.

• Wafer test (max. 12'' wafer)
• PXI test systems
• Test programming (LabView, Python, C)
• Statistical measurement data evaluation

Thanks to our many years of experience in the development and implementation of small-series tests, we reliably ensure quality and adherence to schedules.

• Automated wafer test (max. 12'' wafer)
• Device test
• Test under temperature influence (-40 °C ... 300 °C)
• Quality assurance through statistical evaluation of measurement data

To predict the lifetime of your circuits and components, we work with you to develop an accelerated ageing setup and perform the necessary ageing tests.

• Development of setups for ageing
• Determination of stress conditions
• Evaluation of the ageing development

For the transfer of your developments into production, we organise qualification tests for components or packages according together with you.

• Planning and execution of qualification tests according to JEDEC standard
• Device qualification (HTOL, LTOL, Latch-Up, ESD, etc.)
• Package qualification (HTSL, UHAST, TC, etc.)
• Development of a suitable test environment

To ensure and monitor your high-quality technology and products, we offer development- and production-accompanying tests.

• Measurements of component parameters
• ESD investigations according to HBM and TLP standards
• Characterisation for semiconductor technology (CMOS, SOI, BiCMOS)
• Reliability and quality assurance studies for semiconductor manufacturers

• RF- and EMC-compliant circuit design and PCB layout
• Characterisation and test of ICs and assemblies (coaxial and on wafer)
• Impedance and S-parameter measurements up to 50 GHz
• Spectral and signal analysis up to 26 GHz
• Noise measurements up to 26 GHz

• Static and dynamic measurements on optical sensors
• Parameter determination on light sources
• Development of optoelectronic circuits
• Spectral investigations on light sources and detectors
• Measurement and application systems for single photon detectors (SPAD)

• Circuit design for power applications
• Static and dynamic measurements on power semiconductors
• Wafer test up to 1 kV
• Pre-compliance measurement of conducted emissions (EMC)
• Long-term tests on high-voltage components under the influence of temperature (HTRB measurements)

• HBM Standard
• TLP standard
• Wafer test
• Device test

• Test up to 300 °C
• Wafer test
• Device test
• Development of test solutions for high-temperature test

• Vibrometric measurements for the analysis of mechanical vibrations
• Electrical and capacitive vibration excitation
• Wafer test
• Device test