Integrated Circuits
We offer the design and realisation of application-specific integrated circuits (ASICs) in CMOS, BiCMOS and SOI technologies. Many years of experience and profound ASIC development know-how are our foundation to find the best solutions for your application. Together with you we acquire a development concept leading to the perfected compromise between performance, operating conditions and manufacturing costs.
For the design of an integrated circuit we balance the limitations of accuracy and bandwidth, power consumption, chip size and the choice of technology as an example. Such a concept is then implemented according to our qualified ASIC design flow. Thanks to a close collaboration between our design and test engineers as well as with our manufacturing partners, we achieve well-performing ASICs with our first runs (first-time right silicon).
Our team consists of specialists for
- analog circuit design,
- digital circuit design,
- mixed-signal verification,
- opto electronics and
- radio frequency technology.
- Specification development,
- Circuit design and verification,
- Layout and test development,
- Wafer processing,
- Characterisation and test,
- Qualification and transition to manufacture.
We document all phases intensively and organize regular project reviews with our customers. We employ certified partnersfor all process steps that we cannot operate in-house, e.g. manufacturing and dicing of wafers, or wire bonding and packaging of the ASICs.
- Concept and feasibility studies
- System modeling and simulation
- FPGA and virtual prototyping
- Analog, digital and mixed-signal design
- Analog, digital and mixed-signal verification
- Layout design
- Synthesis and place-and-route
- Automatic Test Pattern Generation (ATPG)
- Precision amplifiers,
- radio-frequency (RF) circuit upto 5 GHz,
- high-voltage (HV) circuits upto 200 V,
- high-temperature (HT) circuits upto 300 °C,
- control loops,
- clocked circuits,
- integrated optical receivers,
- integrated sensors,
- digital interfaces,
- complex sequence controllers,
- embedded microcontrollers,
- firmware and driver software.
- Operational and instrumentation amplifiers (op-amp),
- transimpedance amplfiers (TIA) and charge-sensitive amplifiers (CSA),
- low-noise and power amplifiers (LNA, PA), mixers and filters,
- current and voltage regulators (LDO) and converters (DCDC),
- delta-sigma modulators (DSM) and phase-locked loops (PLL),
- bandgap, power-on-reset- (POR) and delay circuits,
- integrated photodiodes as well as temperature and pH sensors,
- self-test and calibration circuits (BIST),
- A/D converters (ADC) and D/A converters (DAC),
- communication interfaces (SPI, I2C, PWM, SENT, DALI),
- actor and bus drivers
- and other components.
We chose the appropriate design methodology
Being a Lead Institution for Analog Mixed-Signal Design Methodology in the Cadence Academic Network, we are familiar with the newest design methods and tools. For the implementation of a mixed-signal ASIC for instance, we use classical techniques based on Verilog-AMS as well as modern approaches for modelling and synthesis based on high abstraction levels with SystemC. Depending on the application, we always evaluate individually if your objectives are achievable with established or innovation practices.
We use the following design tools:
We are familiar with the latest Cadence design software. Our specially developed design environment software manages the design data as well as the setup of the design tools and controls the users’ access privileges.
Contact
Contact
Eric Schäfer, M. Sc.
Head of Microelectronics / Branch Office Erfurt
eric.schaefer(at)imms.de+49 (0) 361 663 25 35
Eric Schäfer and his team research Integrated sensor systems, especially CMOS-based biosensors, ULP sensor systems and AI-based design and test automation. The results are being incorporated into research on the lead applications Sensor systems for in-vitro diagnostics and RFID sensor technology. It will assist you with services for the development of Integrated circuits and with IC design methods.
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Reference
Damir Redžepagic, ArtIC Solutions
”Their experience in digital IC design, synthesis, place and route, verification and sign-off using the state-of-the art tools and methods makes IMMS a great partner to work with when developing mixed-signal integrated sensors.”
Reference
Hans-Christian Fritsch, Ilmsens
“We were particularly pleased that we, as a start-up from Thüringen with IMMS as its research institute, were able to create an innovative high-tech solution with the Thuringian semiconductor manufacturer X-FAB. We appreciate the high level of expertise and flexibility as well as the customer-oriented and target-oriented way of working of the colleagues from IMMS.”
Reference
Dalibor Stojkovic, ams OSRAM
“We appreciate both the technical expertise of IMMS and the high level of their commitment to our joint projects. The proactive and agile way of working of the IMMS colleagues is an essential building block for our joint success.”
Reference
Dr. Michael Neubert, Baker Hughes Inteq GmbH
“Increasingly, we are implementing our electronic modules with the help of integrated circuits in order to meet the high demands on the functionality and reliability of our tools while at the same time maintaining a high level of circuit complexity. This is a major project for which we have sought the expertise of IMMS. We have come very much to appreciate the know-how and determination of the staff of the Institute.”
Propagation Delay Estimation for Mixed-Signal Modeling of Comparators
Martin Grabmann1. Eric Schäfer1. Georg Gläser1.2024 20th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Volos, Greece, July 02-05, 2024
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany.DI-Meta-X: Bridging the Gap with Meta Formats
Georg Gläser1. Melanie Wilhelm2. Robert Fischbach3. Detlef Bille4. Jan Mehner5. Peter Kreutziger6.Auftaktveranstaltung Chipdesign Germany, 6. - 7. Juni 2024, Hannover
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany. 2X-FAB Global Services GmbH, Erfurt, Germany. 3Technische Universität Dresden, Dresden, Germany. 4EDC Electronic Design Chemnitz GmbH, Chemnitz, Germany. 5i-ROM GmbH, Neukirchen bei Chemnitz, Germany. 6AMAC ASIC- und Mikrosensoranwendung Chemnitz GmbH, Chemnitz.Trust is good, monitoring is better: An FPGA/TEE-Based Monitoring-Approach to Malware Detection and Prevention
Friederike Bruns1. Georg Gläser2. Florian Kögler2. Jonas Lienke2. Nithin Ravani Nanjundaswamy3. Gregor Nitsche3. Behnam Razi Perjikolaei1. Jörg Walter1.edaWorkshop 2024 and the European Nanoelectronics Applications, Design & Technology Conference (ADTC), 9. - 10. April 2024, Dresden, Germany
1OFFIS e.V. Institut für Informatik Oldenburg. 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany. 3DLR Institut für Systems Engineering für zukünftige Mobilität.Automatisiertes Testen mikroelektronischer Schaltungen – Fuzzing findet Bugs in Hardware
Henning Siemen1. Jonas Lienke1. Georg Gläser1.Elektronik, 21.2023, 18. Oktober 2023, Seite 64 - 67, ePaper: wfm-publish.blaetterkatalog.de/frontend/mvc/catalog/by-name/ELE
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.
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Core topic
ULP sensor systems
We research and develop ultra-low-power (ULP) sensor systems that require very little power and have integrated energy management components. Our goal is to use them to open up new applications for the Internet of Things.
Research field
Integrated sensor systems
Here we investigate miniaturised systems manufactured in semiconductor technology consisting of microelectronic components for sensors applications, as well as methods to design these highly complex systems efficiently and safely.
Service for R&D
IC design methods
We develop new AI-based methods and tools for your system-on-chip and FPGA designs to master the increasing complexity of integrated systems and thus further increase performance.