1st Place – EDA Competition Award für den Beitrag: Trash or Treasure? Machine-learning based PCB layout anomaly detection with AnoPCB
2021 18th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 19 – 22 July 2021, Erfurt, Germany, online
Related content
Project
IntelligEnt
The IMMS researched assistance systems for chip designers: Machine Learning improves design and test methods for integrated analogue/mixed-signal systems.
Machine-Learning im PCB-Entwurf: Open-Source zwischen Forschung, Potential und Alltag
Georg Gläser1.30. Konferenz des Fachverbandes für Design, Leiterplatten- und Elektronikfertigung (FED), 29. - 30. September 2022, Potsdam, Germany
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany.Intelligente Layoutverarbeitung: KI für ASIC- und PCB-Layouts
Georg Gläser1. Julian Kuners1.Elektronik 03.2022, 09.02.2022, S. 42 - 45
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.Machine-Learning-basierte Messdatenanalyse für ASICs. Testen auf der Überholspur
Tom Reinhold1. Georg Gläser1.Elektronik 01/02.2022, 26.01.2022, S. 46 - 48
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.Trash or Treasure? Machine-learning based PCB layout anomaly detection with AnoPCB
Henning Franke1. Paul Kucera1. Julian Kuners1. Tom Reinhold2. Martin Grabmann2. Patrick Mäder1. Marco Seeland1. Georg Gläser2.2021 17th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Proceedings in: 423 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom, ISBN 978-3-8007-5588-2, E-Book: ISBN 978-3-8007-5589-9, ieeexplore.ieee.org/document/9547913, 19 - 22 July 2021, Erfurt, Germany, online
1Technische Universität Ilmenau, Germany. 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, 98693 Ilmenau, Germany.
Event,
FED Conference
30th Conference of the German Association for Design, Printed Circuit Board and Electronics Manufacturing (FED)
Event,
Forum Künstliche Intelligenz
Artificial Intelligence Forum of the German specialist media Elektronik, Elektronik automotive und Computer&AUTOMATION. The forum was cancelled by the organiser.
Event,
KI für KMU
KI für KMU – Prozesse optimieren mit künstlicher Intelligenz, Vortragsveranstaltung von Mittelstand 4.0
Event,
CadenceLIVE Europe 2020
CadenceLIVE brings together technology users, developers, and industry experts to connect, share ideas and best practices, and inspire design creativity.
Press release,
EDA Competition Award for "Trash or Treasure" - Intelligent Layout Processing
1st prize of the IEEE CEDA goes to young scientists from Ilmenau TU and IMMS
Press release,
Forschergruppe „IntelligEnt“ gestartet: Künstliche Intelligenz und Machine Learning für den Entwurf von Mikroelektronik
IMMS und TU Ilmenau forschen an neuartigen Assistenzsystemen für Chip-Designer
This could also interest you
Core topic
AI-based design and test automation
We are researching to use AI to make the development process of integrated sensor systems safer and more cost-effective. AI can help developers in the process to avoid errors and apply informal knowledge in an automated way.
Service for R&D
IC design methods
We develop new AI-based methods and tools for your system-on-chip and FPGA designs to master the increasing complexity of integrated systems and thus further increase performance.
Research field
Integrated sensor systems
Here we investigate miniaturised systems manufactured in semiconductor technology consisting of microelectronic components for sensors applications, as well as methods to design these highly complex systems efficiently and safely.
Core topic
Modular and mobile test systems
Test capabilities are an integral part of all application developments. We research modular test systems that can be adapted flexibly and quickly to new challenges through optimised functional test units.
Contact
Contact
Eric Schäfer, M. Sc.
Head of Microelectronics / Branch Office Erfurt
eric.schaefer(at)imms.de+49 (0) 361 663 25 35
Eric Schäfer and his team research Integrated sensor systems, especially CMOS-based biosensors, ULP sensor systems and AI-based design and test automation. The results are being incorporated into research on the lead applications Sensor systems for in-vitro diagnostics and RFID sensor technology. It will assist you with services for the development of Integrated circuits and with IC design methods.