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Event

1071. Symposium ”Sense. Enable. SPITSE. 2015“

3 contributions to the Second International Scientific Symposium ”Sense. Enable. SPITSE. 2015“, St. Petersburg Electrotechnical University ”LETI“, St. Petersburg, Russia

Reference

1072. ANCONA

Computer-aided verification methods have been created as fresh impetus for Industry 4.0 developments. Photograph: IMMS.

Computer-aided verification methods have been developed to accelerate the design of Industry 4.0 applications.

Media library

1073. Final report Anubis 2014

Abschlussbericht Anubis 2014 Inhaltsverzeichnis 1 Einleitung 1.1 Forschungsthema . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Projektablauf . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 5 7 2 Stand von Wissenschaft und Technik 2.1 Passive Maßnahmen zur Reduktion des Energieverbrauchs . . . . . . . . . . . . . . . . 2.2 Aktive Maßnahmen zur Reduktion des Energieverbrauchs . . . . . . . . . . . . . . . . . 2.3…

Reference

1074. Sensor-/Aktornetzwerke für Industrie-4.0-Anwendungen

Tino Hutschenreuther, Thüringer Maschinenbautag des Thüringer Zentrums für Maschinenbau (ThZM), 10.06.2015, Messe, Erfurt

Event

1075. Thüringer Maschinenbautag

Reference

1076. Seamless Design Methodology for heterogeneous Systems – Challenges for research, education, industry and EDA

Ralf Sommer, Design Automation Conference (DAC), 07. – 11.06.2015, Panel: "The needs and expectations of a fruitful industrial and academic cooperation", San Francisco, USA

Event

1077. DAC 2015

Invited Talk: “Seamless Design Methodology for heterogeneous Systems – Challenges for research, education, industry and EDA” Panel: “The needs and expectations of a fruitful industrial and academic cooperation”

Reference

1078. DE 10 2013 113 378

Electronic circuit for determining the time instant of an extremum of a capacitor's time-varying capacitance

Method and electronic circuit for determining the time instant of an extremum of a time-varying capacitance

Media library

1079. 2009 Annual Report | Article PMS380 (en/de)

2009 Jahresbericht | Fachartikel PMS380 (en/de) LASER DICING TECHNOLOGY FOR THIN SEMICONDUCTOR WAFERS PLANAR PRECISION DRIVE FOR 12 INCH WAFER DICING „As a result of competent and creative collaboration, at the end of 2009, the company ALSI was able to take the ﬁrst prototype of its new 12 inch laser dicing platform into operation. The achieved extreme precision, reproducibility and productivity of the laser dicing technology are at the forefront of international excellence. This is signiﬁcantly boosted by the planar drive system developed by the IMMS. The close cooperation with the IMMS…

Reference

1080. HoTSens

Tests for an ASIC developed by IMMS for extremely precise measurements in very hot environments. Photograph: IMMS.

Integrated sensors and microelectronics operate at 300°C, enabling more efficient processes