Patent Eric Schäfer, M. Sc.
Head of Microelectronics / Branch Office Erfurt
Eric Schäfer and his team research Integrated sensor systems, especially CMOS-based biosensors, ULP sensor systems and AI-based design and test automation. The results are being incorporated into research on the lead applications Sensor systems for in-vitro diagnostics and RFID sensor technology. It will assist you with services for the development of Integrated circuits and with IC design methods.
Date of first publication:11 November 2014
Related content

Project
NeAIxt
IMMS expands its UHF RFID sensor transponder ICs with innovative memory technology for smart sensor applications in logistics

Project
PANDIA
IMMS develops novel CMOS and SPAD sensor ICs for spectroradiometers for faster and more sensitive analysis of light

Project
ScoreChip
IMMS is developing a SPAD-based line sensor for chemiluminescence detection to create a flexible microfluidic scanner platform for the cost-effective detection of biochemical reactions

Press release,
Innovative spectroradiometers for better analysis of light
Thuringian PANDIA project launched

Press release,
Energieeffizienz für serielle Inter-Chip-Kommunikation mit kommerziellen drahtlosen Sensoren
iENA-Silbermedaille für Latch-basierten aktiven Ultra-Low-Power-Pull-Up-Emulator
Press release,
Silicon Science Award geht an Nachwuchsforscher von IMMS und TU Ilmenau
Arbeit zu zeitkorrelierter Einzelphotonenzählung für Messungen im Pikosekundenbereich ausgezeichnet
Adaptiver Frontend-ASIC für elektrostatische Energy-Harvester
Benjamin Saft1. Eric Schäfer1. André Jäger1. Alexander Rolapp1. Eckhard Hennig2.8. GMM-Workshop „Energieautarke Sensorik“, 25.02.216 – 26.02.2016, Renningen (Robert Bosch GmbH) Germany
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, D-98693 Ilmenau, Germany. 2Hochschule Reutlingen, D-72762 Reutlingen, Germany.An Ultra-Low Power Capacitance Extrema and Ratio Detector for Electrostatic Energy Harvesters
Benjamin Saft1. Eric Schäfer1. Alexander Rolapp1. Eckhard Hennig2.41th European Solid-State Circuits Conference ESSCIRC, 14-18 Sept. 2015, Pages 245 - 248, DOI: dx.doi.org/10.1109/ESSCIRC.2015.7313873, ISBN: 978-1-4673-7470-5, Graz, Austria
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, D-98693 Ilmenau, Germany. 2Hochschule Reutlingen, D-72762 Reutlingen, Germany.Vibration energy generators for low-frequency spectral excitations
Bianca Leistritz1,2. Michael Katzschmann1. Hannes Toepfer1,2.EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers, in Procedia Engineering, Volume 87, 2014, Pages 420 – 423, www.sciencedirect.com,
1IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, D-98693 Ilmenau, Germany. 2Technische Universität Ilmenau, D-98693 Ilmenau, Germany.A Low-Voltage Low-Power CMOS Time-Domain Temperature Sensor Accurate To Within [-0.1,+0.5]˚C From -40˚C To 125˚C
Jun Tan. Alexander Rolapp. Eckhard Hennig.12th IEEE Asia Pacific Conference on Circuits and Systems (APCCAS 2014), Session Sensor Systems and Emerging Memory Technology, pp. 463 – 466, IEEE Catalog Number: CFP14APC-USB, ISBN: 978-1-4799-5229-8, Ishigaki Island, Okinawa, Japan

Event,
FPGA Ignite Summer School
Networking, exciting lectures and a hackathon on designing a custom RISC-V SoC

Event,
SMACD 2024
International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)
Contact
Contact
Dr.-Ing. Ludwig Herzog
Head of Mechatronics
ludwig.herzog(at)imms.de+49 (0) 3677 874 93 60
Dr. Ludwig Herzog will provide detail on our research on magnetic 6D direct drives with nm precision for the nm measurement and structuring of objects. He supports you with services for the development of mechatronic systems, for simulation, design and test of MEMS as well as for finite element modelling (FEM) and simulation.
Contact
Dipl.-Ing. Michael Meister
Head of Industrial Electronics and Measurement Technology
michael.meister(at)imms.de+49 (0) 3677 874 93 20
Michael Meister is your contact for testing services, the development of test methodologies, and long-term measurements. He answers your questions on Modular and mobile test systems that we develop in our research in Smart distributed measurement and test systems as well as about testing and characterisation of integrated sensor systems. He is responsible for the test equipment at IMMS and will support you in the validation of ASIC and MEMS developments.
Microelectronics department
Our microelectronics team is internationally positioned and consists of specialists for:
- Analog IC Design
- Digital IC Design
- Mixed-Signal Verification
- IC Layout
- Design Methodology
- EDA Support
- Business Development
Most of our scientific staff have academic degrees in electrical engineering and information technology, microelectronics and engineering informatics, or in disciplines such as biomedical engineering or solid-state physics.
Every year, we launch about ten ASICs for research and industrial customers and supervise about 15 students at our two locations in Erfurt and Ilmenau.
We support you with research and development in the following areas
Back


















