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TuZ 2016

Date, Type of contribution, Location:
,Poster,Siegen
Event:
Two presentations at the 28th GMM/GI/ITG Workshop on test methods and reliability of circuits

Description:

Monday, 7 March 2016, 15:00  – 16:00 (two poster presentations, both in German):

Test circuit for a MEMS inertial sensor readout ASIC (Testschaltung für MEMS-Inertialsensoren-Auswerte-ASIC), R. Paris, P. Kornetzky, J. Klaus

High-temperature wafer tests up to 300°C (Hochtemperatur-Wafertest bis 300°C ), M. Reinhard, I. Gryl, U. Liebold, A. Richter

Related content

Project

HoTSens

Integrated sensors and microelectronics operate at 300°C, enabling more efficient processes

Project

MEMS2015

The IMMS tool automatically generates mechanical designs. MEMS can be simulated and verified as an entire system.

Press release,

Best Paper Award Runner-Up for MEMS-ASIC-Gesamtdesignmethodik

Implemented acceleration sensor to validate the novel method

Press release,

MEMS design methodology honoured with the EDA Achievement Award 2015

IMMS and Ilmenau TU’s methodology opens up cost-efficient MEMS developments and novel applications.

Award

Best Paper Award Runner-Up für den Beitrag: Systematic MEMS ASIC Design Flow using the Example of an Acceleration Sensor

Jenny Klaus

Contact

Contact

Dipl.-Hdl. Dipl.-Des. Beate Hövelmans

Head of Corporate Communications

beate.hoevelmans(at)imms.de+49 (0) 3677 874 93 13

Beate Hövelmans is responsible for the text and image editorial work on this website, for the social media presence of IMMS on LinkedIn and YouTube, the annual reports, for press and media relations with regional and specialist media and other communication formats. She provides texts, photographs and video material for your reporting on IMMS, arranges contacts for interviews and is the contact person for events.

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