TuZ 2016
Description:
Monday, 7 March 2016, 15:00 – 16:00 (two poster presentations, both in German):
Test circuit for a MEMS inertial sensor readout ASIC (Testschaltung für MEMS-Inertialsensoren-Auswerte-ASIC), R. Paris, P. Kornetzky, J. Klaus
High-temperature wafer tests up to 300°C (Hochtemperatur-Wafertest bis 300°C ), M. Reinhard, I. Gryl, U. Liebold, A. Richter
Related content
Press release,
Best Paper Award Runner-Up for MEMS-ASIC-Gesamtdesignmethodik
Implemented acceleration sensor to validate the novel method
Press release,
MEMS design methodology honoured with the EDA Achievement Award 2015
IMMS and Ilmenau TU’s methodology opens up cost-efficient MEMS developments and novel applications.
Contact
Contact
Dipl.-Hdl. Dipl.-Des. Beate Hövelmans
Head of Corporate Communications
beate.hoevelmans(at)imms.de+49 (0) 3677 874 93 13
Beate Hövelmans is responsible for the text and image editorial work on this website, for the social media presence of IMMS on LinkedIn and YouTube, the annual reports, for press and media relations with regional and specialist media and other communication formats. She provides texts, photographs and video material for your reporting on IMMS, arranges contacts for interviews and is the contact person for events.