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Event

761. Mittelstand 4.0-Regionalkonferenz

Reference

762. Effizientes Design und Layout von 3D Beschleunigungssensoren mittels automatisierter Synthese

Steffen Michael, Maria Kellner Ralf Sommer Analog 2018, 16. GMM/ITG-Fachtagung, 12.-14. September 2018, München-Neubiberg

Reference

763. Design of Quasi-synchronous Finite State Machines Using a Local On-demand Clocking Approach

Athanasios Gatzastras, Dominik Wrana Tobias Wolfer Georg Gläser Benjamin Saft Eric Schäfer Eckhard Hennig Analog 2018, 16. GMM/ITG-Fachtagung, München-Neubiberg, 12-14 September 2018, Proceedings: https://www.vde-verlag.de/proceedings-en/454754003.html

Event

764. Analog 2018

16. GMM/ITG-Fachtagung

Reference

765. Design and Performance of Power Amplifier Integration with BAW Filter on a Silicon-Ceramic Composite and Standard Epoxy/Glass Substrate

Vikrant Chauhan, Wilfried Wandji Xuejiao Peng Victor Silva Cortes Astrid Frank Michael Fischer Uwe Stehr Robert Weigel Amelie Hagelauer 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Ann Arbor, MI, 2018, 16-18 July, pp. 1-3. DOI: https://doi.org/10.1109/IMWS-AMP.2018.8457140

Event

766. FDL 2018

Lecture at the conference ”Forum on specification & Design Languages“: Session 1, Event-driven Modeling and Simulation, Monday 10, September 2018, 15:00 pm - 16:30 pm From Low-Power to No-Power: Adaptive Clocking for Event-Driven Systems Authors: Georg Gläser1 , Benjamin Saft1, Dominik Wrana2 , Athanasios Gatzastras2 , and Eckhard Hennig2 1IMMS Institut fürMikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ilmenau, Germany 2Reutlingen University, Reutlingen, Germany

Reference

767. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors

Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic

Event

768. 6. Workshop „Sensorik 4.0“

„Ein Schritt in Richtung Industrie 4.0 - Industrie-4.0-konforme Kommunikation mit OPC-UA“, Fortsetzung der Workshop-Reihe: „Sensorik 4.0“

Event

769. ISPS 2018

Lecture: Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors Authors: Ralf Lerner1, Klaus Heinrich1, Marco Erstling1, Peter Kornetzky2 1X-FAB Semiconductor Foundries GmbH, Erfurt, Germany 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany

Reference

770. Impact Rating of Layout Parasitics in Mixed-Signal Circuits: Finding a Needle in a Haystack

Georg Gläser, Martin Grabmann Dirk Nuernbergk 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Prague, 2-5 July 2018, pp. 149-152. DOI: https://doi.org/10.1109/SMACD.2018.8434844