ISPS 2018

Date, Type of contribution, Location:

29 August 2018–31 August 2018,Talk,Prague, CZ

Event:

Further information:

zur Website der ISPS 2018

Lecture: Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors

Authors: Ralf Lerner¹, Klaus Heinrich¹, Marco Erstling¹, Peter Kornetzky²

¹X-FAB Semiconductor Foundries GmbH, Erfurt, Germany

²IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany

Contact

Dipl.-Hdl. Dipl.-Des. Beate Hövelmans

Head of Corporate Communications

beate.hoevelmans(at)imms.de+49 (0) 3677 874 93 13

Beate Hövelmans is responsible for the text and image editorial work on this website, for the social media presence of IMMS on LinkedIn and YouTube, the annual reports, for press and media relations with regional and specialist media and other communication formats. She provides texts, photographs and video material for your reporting on IMMS, arranges contacts for interviews and is the contact person for events.

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