Current Publication
Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors
Ralf Lerner1, Klaus Heinrich1, Marco Erstling1, Peter Kornetzky2
14th International Seminar on Power Semiconductors (ISPS), , Prague, Czech Republic
1X-FAB Semiconductor Foundries AG, Haarbergstraße 67, 99097 Erfurt, Germany, 2IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, Germany
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- Integrated sensor systems
- Smart distributed measurement and test systems
- Magnetic 6D direct drives with nm precision
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Research
- Integrated sensor systems
- Smart distributed measurement and test systems
- Magnetic 6D direct drives with nm precision
Imprint/Disclaimer
Privacy statement
Search
Home
Lead applications
- Sensor systems for in-vitro diagnostics
- RFID sensor technology
- Adaptive edge AI systems for industrial application
- IoT systems for cooperative environmental monitoring
- nm measurement and structuring of objects
- Target markets
Career
- Vacancies and application process
- Doctorates
- Internships, jobs, BSc/MSc subjects
- Vocational Training
- Questions and answers
Social Media
Services for research and development
- Integrated Circuits
- IC design methods
- Test and characterisation
- Development of embedded systems
- Development of mechatronic systems
- MEMS – simulation, design and test
- Finite Element Modeling
About us