IMMS - Search

Reference

61. Andrea Kulik, FRIZ Biochem

We were particularly impressed by IMMS’s ability to take a holistic approach to the interface between biochemical applications and electronic signal processing. This enabled our biochemical and technical requirements to be precisely translated into microelectronic concepts and implemented in a space-efficient manner.

Reference

62. DE 10 2024 130 098

Schematischer Querschnitt eines CMOS-ISFET mit einer ARC-Schicht

Ion-sensitive field-effect transistors

Service for R&D

63. Integrated Circuits

For our ASIC developments, we involve in-house test engineers and manufacturing partners right from the start. Photograph: IMMS.

Service for R&D: Integrated Circuits. We offer the design and realisation of application-specific integrated circuits (ASICs) in CMOS, BiCMOS and SOI technologies. We achieve well-performing ASICs with our first runs (first-time right silicon).

Research field

64. Research

We connect the digital to the analog world. Photograph: IMMS.

Research: We conduct research to harness cutting-edge results from science for industry. Through application-oriented developments we strengthen industry's competitiveness with innovations.

Reference

65. Evaluation of triboelectric nanogenerators for low-frequency vibrations and their potential in wireless sensor networks

Marios Kaminiotis, Silvia Krug, Hannes Toepfer, Romain Noël, Julien Le Scornec, Vincent Le Cam, Bastien Chapuis, 2026 Smart Mater. Struct.

Reference

66. Very steep LED light pulses: a selection-guideline

Vincent Haude, Alexander Rolapp, Michael Meister, Catania, Italy 2026 2026 IEEE 23rd International Multi-Conference on Systems, Signals & Devices (SSD)

Event

67. IEEE SSD 2026

Two hands hold circuit boards the size of euro coins with an LED in the centre.

The International Multi-Conference on Systems, Signals and Devices

Reference

68. Information statt Daten – Möglichkeiten zur Sensordatenverarbeitung am Sensor oder in Edge-Systemen

Tino Hutschenreuther, Erfurt, Germany 2026 „Detect“ Netzwerktreffen

Reference

69. Parameter extraction such as layer thickness and stress at wafer level for process monitoring in semiconductor manufacturing

Steffen Michael, Waldbronn, Germany 2026 Microstructure User Meeting 2026, Symposium zur optischen Schwingungsmessung

Event

70. Microstructure User Meeting 2026

New 3D vibrometer system for MEMS. Photograph: IMMS.

Symposium on optical vibration measurement