1732 results
Reference
  151. Tip- and laser-based nanofabrication up to 100 mm with sub-nanometre precision  
Ingo Ortlepp, Michael Kühnel, Martin Hofmann, Laura Weidenfeller Johannes Kirchner, Shraddha Supreeti Rostyslav Mastylo, Mathias Holz Thomas Michels, Roland Füßl Ivo W. Rangelow, Thomas Fröhlich Denis Dontsov Christoph Schäffel Eberhard Manske Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 113240A (23 March 2020), DOI: https://doi.org/10.1117/12.2551044  
Reference
  152. Timing Accurate Synthesis of Digital SystemC Components in a Mixed-Signal Environment  
Georg Gläser, Eckhard Hennig CDNLive2014, 19.05.2014 - 21.05.2014, München, Poster  
Press release
  153. Thuringian project develops novel technology platform for the detection of SARS-CoV-2  
Change in electrical conductivity visualises virus material  
Event
  154. Thüringer Kirschentag 2025  
Five boxes suspended from a wire rope, from which cables lead into the ground to buried soil moisture sensors. Thüringer Landesamt für Landwirtschaft und Ländlichen Raum, Lehr- und Versuchszentrum Gartenbau (LVG)  
Reference
  155. thurAI  
In thurAI, IMMS is working on sensor technology for SmartCity and methods to intelligently process data in the network for AI evaluations.  
Reference
  156. Thomas Freitag, Melexis  
”For many years, IMMS has been supporting us in the development and refinement of our ICs, among them those for LIN-based regulation of RGB LEDs. It is our intention to collaborate again with the Institute in the future, continuing to rely on its skills.“  
Reference
  157. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors  
Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic  
Reference
  158. THERMULAB  
The developed highly accurate sensor system, operating at 150°C, improves the efficiency of industrial plants and combustion engines.  
Reference
  159. Thermal Modeling and Measurement of a Power Amplifier Module for a Silicon-Ceramic Substrate  
Astrid Frank, V. Silva Cortes Steffen Michael A. Hagelauer G. Fischer 2018 11th German Microwave Conference (GeMiC), Freiburg, 12-14 March 2018, pp. 79-82. DOI: https://doi.org/10.23919/GEMIC.2018.8335033  
Reference
  160. Thermal Channel Noise of quarter and sub-quarter micron NMOS FET's  
G. Knoblinger, P. Klein U. Baumann ICMTS 2000, USA, CA, Monterey, März 2000  
Search results 151 until 160 of 1732