TuZ 2023
Björn Bieske [1], Pierre Wenke [2], Martin Jäger [3], Ingo Gryl [1], Xiao Liu [2], Jörg Steinecke [2]
[1] IMMS Institut für Mikroelektronik- und MechatronikSysteme gemeinnützige GmbH (IMMS GmbH)
[2] X-FAB Semiconductor Foundries GmbH
[3] X-FAB Global Services GmbH
Abstract:
A further developed measuring environment is presented, which is specially designed for service life tests. It is based on the concept of a universal test chip that can contain a wide variety of function blocks with uniform connections. The bidirectional control of the test objects takes place via a serial interface. The test setup is modular and scalable according to the number of test objects. This enables long-term tests that can be carried out as digital and analogue measurements in parallel. This allows more targeted individual stress tests to be applied at high temperatures in order to carry out an improved analysis of failure causes. The development of the measurement environment and selected applications are presented.
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Research field
Integrated sensor systems
Here we investigate miniaturised systems manufactured in semiconductor technology consisting of microelectronic components for sensors applications, as well as methods to design these highly complex systems efficiently and safely.
Core topic
Modular and mobile test systems
Test capabilities are an integral part of all application developments. We research modular test systems that can be adapted flexibly and quickly to new challenges through optimised functional test units.
Research field
Smart distributed measurement and test systems
Integrated sensor ICs are the heart of sensor and measurement systems like wireless sensors, stationary or handheld devices. We are researching solutions for ever more powerful sensors with more intrinsic intelligence and task allocation in the network.
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Service for R&D
Test and characterisation
We test, characterise and qualify your circuits, sensors and systems. Based on our excellent pool of measurement equipment, we develop an individually adapted test environment for measurements on wafers and individual components.
Contact
Contact
Dipl.-Hdl. Dipl.-Des. Beate Hövelmans
Head of Corporate Communications
beate.hoevelmans(at)imms.de+49 (0) 3677 874 93 13
Beate Hövelmans is responsible for the text and image editorial work on this website, for the social media presence of IMMS on LinkedIn and YouTube, the annual reports, for press and media relations with regional and specialist media and other communication formats. She provides texts, photographs and video material for your reporting on IMMS, arranges contacts for interviews and is the contact person for events.