M. Fischer,
T. Welker
B. Leistritz
S. Gropp
C. Schäffel
M. Hoffmann
J. Müller
Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT): May 2016, Vol. 2016, No. CICMT, pp. 000107-000110, DOI: http://dx.doi.org/10.4071/2016CICMT-WA22
Jan Bumberger,
Hannes Mollenhauer
Paul Remmler
Andrei Marian Chirila
Olaf Mollenhauer
Tino Hutschenreuther
Hannes Toepfer
Peter Dietrich
European Geosciences Union General Assembly, EGU 2016, 17.04.2016-22.04.2016, Open Session on Geosciences Instrumentation and Methods, Vienna, Austria