Publikationsübersicht –MUSIK
Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration
Michael Fischer1, Sebastian Gropp2, Johannes Stegner3, Astrid Frank4, Martin Hoffmann2, Jens Müller1in IEEE Microwave Magazine, vol. 20, no. 10, Oct. 2019, pp. 28-43, 2019, DOI: doi.org/10.1109/MMM.2019.29286751Technische Universität Ilmenau, Institute of Micro- and Nanotechnologies (IMN) MacroNano®, Electronics Technology Group, Gustav-Kirchhoff-Straße 7, 98693 Ilmenau, Germany, 2Technische Universität Ilmenau, Institute of Micro- and Nanotechnologies (IMN) MacroNano®, Micromechanical Systems Group, Gustav-Kirchhoff-Straße 7, 98693 Ilmenau, Germany, 3Technische Universität Ilmenau, Institute of Micro- and Nanotechnologies (IMN) MacroNano®, RF and Microwave Research Group, Gustav-Kirchhoff-Straße 7, 98693 Ilmenau, Germany, 4IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, GermanyEnhancing RF Bulk Acoustic Wave Devices: Multiphysical Modeling and Performance
Vikrant Chauhan1, Christian Huck2, Astrid Frank3, Wolfgang Akstaller1, Robert Weigel1, Amelie Hagelauer1in IEEE Microwave Magazine, vol. 20, no. 10, Oct. 2019, pp. 56-70, 2019, DOI: doi.org/10.1109/MMM.2019.29286771Friedrich Alexander University Erlangen-Nuremberg, Institute for Electronics Engineering, Cauerstr. 7, 91058 Erlangen, Germany, 2University of Augsburg, Institute of Physics, Universitätsstraße 1, 86159 Augsburg, Germany, 3IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, GermanyInvestigation of thermal and non-linear effects on the performance of the power amplifier - BAW filter - chain in a LTE transmitter
Uwe Stehr1, Johannes Stegner1, Vikrant Chauhan2, Victor Silva Cortes2, Robert Weigel2, Amelie Hagelauer2, Astrid Frank3, Steffen Michael3, Matthias A. Hein12018 IEEE International Ultrasonics Symposium, IUS 2018, , Kobe, Japan1Technische Universität Ilmenau, Department of Electrical Engineering and Information Technology, Institute of Information Technology, RF and Microwave Research Group, 98684 Ilmenau, P.O. Box 10 05 65, Germany, 2Friedrich Alexander University Erlangen-Nuremberg, Institute for Electronics Engineering, Cauerstr. 7, 91058 Erlangen, Germany, 3IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, GermanyThermal Modeling and Measurement of a Power Amplifier Module for a Silicon-Ceramic Substrate
Astrid Frank1, Victor Silva Cortes2, Steffen Michael1, Amelie Hagelauer2, Georg Fischer22018 11th German Microwave Conference (GeMiC), , Freiburg, pp. 79-82, DOI: doi.org/10.23919/GEMIC.2018.83350331IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, Germany, 2Friedrich Alexander University Erlangen-Nuremberg, Institute for Electronics Engineering, Cauerstr. 7, 91058 Erlangen, GermanyDesign of a Power Amplifier Module in a Novel Silicon-Ceramic Substrate for an LTE Transmitter
Victor Silva Cortes1, L. Liu1, Uwe Stehr2, Astrid Frank3, Vikrant Chauhan1, Matthias A. Hein2, Jens Müller2, Robert Weigel1, Amelie Hagelauer1Asia Pacific Microwave Conference 2017, , Kuala Lumpur1Friedrich Alexander University Erlangen-Nuremberg, Institute for Electronics Engineering, Cauerstr. 7, 91058 Erlangen, Germany, 2Technical University of Ilmenau, Institute for Micro- and Nanotechnologies (IMN) MacroNano®, 98684 Ilmenau, P.O. Box 10 05 65, Germany, 3IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, GermanyA contribution towards model-based design of application-specific MEMS
Jenny Klaus1, Eric Schäfer1, Roman Paris1, Astrid Frank1, Ralf Sommer1in Integration, vol. 58, pp. 454-462, 2017, DOI: doi.org/10.1016/j.vlsi.2017.03.0141IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, GermanyInvestigations of metal systems in a silicon ceramic composite substrate for electrical and thermal contacts as well as associated mounting aspects
Michael Fischer1, T. Welker1, Bianca Leistritz2, Christoph Schäffel2, Martin Hoffmann1, Jens Müller1Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), , Denver, Colorado, USA, pp. 000107-000110, DOI: dx.doi.org/10.4071/2016CICMT-WA221Technical University of Ilmenau, Institute for Micro- and Nanotechnologies (IMN) MacroNano®, 98684 Ilmenau, P.O. Box 10 05 65, Germany, 2IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, GermanyElectrostatic parallel-plate MEMS-Switch on Silicon-Ceramic-Composite-Substrates
Sebastian Gropp1, Astrid Frank2, Christoph Schäffel2, Martin Hoffmann12015 German Microwave Conference, , Nuremberg, Germany, pp. 414-417, DOI: dx.doi.org/10.1109/GEMIC.2015.71078411Technical University of Ilmenau, Institute for Micro- and Nanotechnologies (IMN) MacroNano®, 98684 Ilmenau, P.O. Box 10 05 65, Germany, 2IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, GermanyModeling of BAW filters for system level simulation
Dominik Karolewski1, Christoph Schäffel1, Andreas Tag2, Victor Silva Cortes2, Amelie Hagelauer2, Georg Fischer22015 German Microwave Conference, , Nuremberg, Germany, pp. 410-413, DOI: dx.doi.org/10.1109/GEMIC.2015.71078401IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, Germany, 2Friedrich Alexander University Erlangen-Nuremberg, Institute for Electronics Engineering, Cauerstr. 7, 91058 Erlangen, GermanyInfluence of temperature distribution on behavior, modeling, and reliability of BAW resonators
Andreas Tag1, Robert Weigel1, Amelie Hagelauer1, B. Bader2, C. Huck2, M. Pitschi2, K. Wagner2, Dominik Karolewski3, Christoph Schäffel32014 IEEE International Reliability Physics Symposium, , Waikoloa, HI, USA, pp. 5C.5.1-5C.5.7, DOI: dx.doi.org/10.1109/IRPS.2014.68606691Friedrich Alexander University Erlangen-Nuremberg, Institute for Electronics Engineering, Cauerstr. 7, 91058 Erlangen, Germany, 2TDK Corporation, Advanced Development, Anzingerstr. 13, 81617 Munich, Germany, 3IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, GermanyAnsätze zur Entwicklung durchgängiger Entwurfsstrategien für MEMS
Jacek Nowak1, Jenny Klaus2, Dominik Karolewski2, Ralf Sommer2,1edaWorkshop 14, Tagungsband, VDE-Verlag, , Hannover, ISBN 978-3-8007-3620-11Technische Universität Ilmenau, Fakultät Elektrotechnik und Informationstechnik, Fachgebiet Elektronische Schaltungen und Systeme, 98684 Ilmenau, P.O. Box 10 05 65, Germany, 2IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, Germany