Against hacker attacks: Innovative chip architectures, modelling and verification methods for trustworthy electronics
Hackers are already targeting networked vehicles, machines, industrial and telecommunications systems to gain illegal advantages, such as harming competitors, stealing intellectual property or leaking sensitive data.
At the same time, there is a growing need to make automotive systems, corporate and production networks more functional, convenient, traffic-safe and energy- and cost-efficient. These requirements alone are not only making the systems more and more complex and demanding in their development. They are also becoming increasingly networked. More complexity and more networking also offer more opportunities for attacks on these systems, which can also have a greater impact and are therefore also more lucrative for offenders.
In the project, IMMS and its partners are securing the design of integrated systems through innovative chip architectures and automated modelling and verification methods. This should enable the trustworthiness of the system to be continuously checked not only during the design, but also during operation, and thus a hacker attack to be blocked.
Acronym / Name:VE-VIDES / Design methods and HW/SW co-verification for the unique identifiability of electronic components
Duration:2021 – 2024
Application:|IC design| chip design| design methodology| AI| models| modelling| design support
Research field:Integrated sensor systems
Eric Schäfer, M. Sc.
Head of Microelectronics / Branch Office Erfurt
eric.schaefer(at)imms.de+49 (0) 361 663 25 35
Eric Schäfer and his team research Integrated sensor systems, especially CMOS-based biosensors, ULP sensor systems and AI-based design and test automation. The results are being incorporated into research on the lead applications Sensor systems for in-vitro diagnostics and RFID sensor technology. It will assist you with services for the development of Integrated circuits and with IC design methods.
The joint project VE-VIDES is funded by the Federal Ministry of Education and Research under the reference 16ME0246.