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Press release

891. Rapid Prototyping Platform for Embedded System Solutions

BASe-Box with Smart Home extension board. Photograph: IMMS.

Embedded world 2014, Hall 5, Booth 276.

Reference

892. MEMS-T-Lab

In this test lab IMMS takes highly complex measurements of complete MEMS wafers at a new level of automation. Photograph: IMMS.

In the MEMS-T-Lab, IMMS takes highly complex semi-automated measurements for complete MEMS wafers

Reference

893. Vibration energy generators for low-frequency spectral excitations

Bianca Leistritz, Michael Katzschmann Hannes Toepfer EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers, in Procedia Engineering, Volume 87, 2014, Pages 420 – 423, http://www.sciencedirect.com, DOI: http://dx.doi.org/10.1016/j.proeng.2014.11.283

Reference

894. Perforated plates of inertial sensors – modeling by effective material properties

Steffen Michael, Astrid Frank G. Hölzer G. Lorenz EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers, in Procedia Engineering, Volume 87, 2014, Pages 480 – 483, http://www.sciencedirect.com, DOI: http://dx.doi.org/10.1016/j.proeng.2014.11.400

Reference

895. Integriertes elektrostatisches MEMS-Energy-Harvesting-Modul

Benjamin Saft, Fachzeitschrift Mechatronik 1-2, 2015

Reference

896. sMobiliTy

Installation of a wireless traffic sensor in Erfurt, Germany. Photograph: IMMS.

The wireless sensor system developed by IMMS to contribute to mobility with electric vehicles.

Reference

897. MUSIK

IMMS investigated and modelled MEMS and BAW resonater characteristics to develop basic blocks for MEMS design. Photograph: IMMS.

IMMS has investigated, modelled and validated MEMS characteristics to develop basic blocks for a universally applicable method for MEMS design.

Press release

898. Intelligent measuring clamp detects parasitic currents in industrial plant

In a project with its partner Indu-Sol, IMMS developed the intelligent measuring clamp 'EMCheck® ISMZ I'. Photograph: IMMS.

Presented by IMMS at the embedded world 2015, Hall 4, Booth 160 (OSADL joint booth).

Reference

899. High-Frequency Performance of GaN High-Electron Mobility Transistors on 3C-SiC/Si Substrates With Au-Free Ohmic Contacts

Wael Jatal, Uwe Baumann Katja Tonisch Frank Schwierz Jörg Pezoldt Electron Device Letters, IEEE, Volume:36, Issue: 2, Page(s) 123-125, DOI: http://dx.doi.org/10.1109/LED.2014.2379664

Reference

900. S4ECoB

The embedded platform for acoustic signal processing being put into operation. Photograph: IMMS.

The embedded platform developed by IMMS processes acoustic signals and is part of a system that improves the energy-efficiency of public buildings.