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Reference

681. Flexible Hardware/Softwareplattformen für intelligente Industrie 4.0-Geräte

Tino Hutschenreuther, Wolfram Kattanek elmug4future, Technologiekonferenz 2016, 21.06.2016, Friedrichroda

Reference

682. On the Role of Wireless Sensor Networks for Intelligent Transportation Systems

Silvia Krug, Jochen Seitz Elena Chervakova Hannes Toepfer Sense. Enable. SPITSE, 2016, 20.06.2016 - 24.06.2016, Moskau, Russland

Reference

683. An Approach to Extract Significant Features for Vehicle Classification Based on Magnetic Field Sensor Data

Vladimir Shkoda, Sylvia Braeunig Marco Goetze Hannes Toepfer Sense. Enable. SPITSE, 2016, 20.06.2016 - 24.06.2016, Moskau, Russland

Reference

684. Intelligente Lösungen für Industrie 4.0 - Diagnose und Überwachung in industriellen Anlagen

Tino Hutschnreuther, 2. Maschinenbautag, 15.06.2016, Erfurt

Reference

685. fast realtime

Measuring energy needs with prototypes that monitor trains in real time with a local wireless sensor network. Photograph: IMMS.

Smart transport to be monitored in real time

Press release

686. RoMulus research project: Intelligent sensor systems for Industry 4.0

In the RoMulus project, IMMS and ten partners are working on intelligent sensor systems for Industry 4.0. Photograph: Bosch.

Reducing development and manufacturing costs

Reference

687. Tri-Gate Al0.2Ga0.8N/AlN/GaN HEMTs on SiC/Si-substrates

Wael Jatal, Uwe Baumann Heiko O. Jacobs Frank Schwierz Jörg Pezoldt Materials Science Forum, ISSN: 1662-9752, Vol. 858, pp 1174-1177, DOI: http://www.scientific.net/MSF.858.1174, ©2016 Trans Tech Publications, Switzerland

Reference

688. MEMS-Vibro3D

New 3D vibrometer system for MEMS. Photograph: IMMS.

Research infrastructure for the next MEMS generation: 3D vibrometer system and new broadband amplifier

Reference

689. RoMulus

Systematic design and economical manufacture for intelligent multi-sensor systems in small quantities

Reference

690. Investigations of metal systems in a silicon ceramic composite substrate for electrical and thermal contacts as well as associated mounting aspects

M. Fischer, T. Welker B. Leistritz S. Gropp C. Schäffel M. Hoffmann J. Müller Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT): May 2016, Vol. 2016, No. CICMT, pp. 000107-000110, DOI: http://dx.doi.org/10.4071/2016CICMT-WA22