171. IC-Entwicklung: Effizientere Simulation mit KI-basierter Modellfehlerschätzung   Henning Siemen, Martin Grabmann Eric Schäfer Georg Gläser Elektronik, 17-18/2023, 23. August 2023, Seite 66 - 69, ePaper: https://wfm-publish.blaetterkatalog.de/frontend/mvc/catalog/by-name/ELE?catalogName=ELE2317D  

  172. A Circuit Designer’s Perspective to MOSFET Behaviour: Common Questions and Practical Insights   Ralf Sommer, Carsten Thomas Gatermann Felix Vierling Advances in Science, Technology and Engineering Systems Journal, vol. 8, no. 4, pp. 41-59 (2023), DOI: https://dx.doi.org/10.25046/aj080406  

  173. Optimizing the IoT Performance: A Case Study on Pruning a Distributed CNN   Eiraj Saqib, Isaac Sánchez Leal Irida Shallari Axel Jantsch Silvia Krug Mattias O'Nils 2023 IEEE Sensors Applications Symposium (SAS), 18-20 July 2023, Ottawa, ON, Canada, July 18-20, 2023, pp. 1-6, DOI: https://doi.org/10.1109/SAS58821.2023.10254054.  

  174. Vertikale Nanopositionierung mit bis zu 25 mm Verfahrweg – Hubmodule für die hochgenaue Positionierung im Raum   Stephan Gorges, Steffen Hesse Ludwig Herzog Konstruktion (2023), 07-08, Sonderteil Antriebstechnik, Seite 28 - 31, VDI Fachmedien, ISSN 0720-5953, https://e-paper.vdi-fachmedien.de/konstruktion/2023#17-07-2023  

  175. Robust Adaptive Tracking Control of a 3D Vertical Motion System for Nanometer Precision Applications   Alex S. Huaman, Johann Reger 22nd IFAC World Congress, Yokohama, Japan, July 9-14, 2023, IFAC-PapersOnLine, Volume 56, Issue 2, 2023, Pages 5332-5339, ISSN 2405-8963, DOI: https://doi.org/10.1016/j.ifacol.2023.10.177.  

  176. Under Cover: On-FPGA Coverage Monitoring by Netlist Instrumentation   Manuel Jirsak, Henning Siemen Jonas Lienke Martin Grabmann Eric Schäfer Georg Gläser 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Funchal, Portugal, July 03-05, 2023, pp. 1-4, DOI: https://doi.org/10.1109/SMACD58065.2023.10192205  

  177. SHUT OFF! - Hybrid BICMOS Logic for Power-Efficient High Speed Circuits   Christoph W. Wagner, Niklas Bräunlich Kevin E. Drenkhahn Georg Gläser 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Funchal, Portugal, July 03-05, 2023, pp. 1-4, DOI: https://doi.org/10.1109/SMACD58065.2023.10192217  

  178. Hot Fuzz: Assisting verification by fuzz testing microelectronic hardware   Henning Siemen, Jonas Lienke Georg Gläser 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Funchal, Portugal, July 03-05, 2023, pp. 1-4, DOI: https://doi.org/10.1109/SMACD58065.2023.10192176  

  179. Characterizing Dynamics of MEMS Devices on Wafer Level Using Optical Measurement Techniques   Sebastian Giessmann, Steffen Michael Eric Lawrence Dr. Heinrich Steger Commercial Micro Manufacturing International Magazine (CMM Magazine), 08-2023, VOL 16 NO. 3, pp. 30-39