Mirjam Mantel, Siemens AG

”The close cooperation with IMMS was characterised by a practical and application-oriented approach. The partnership has exceeded our expectations and we consider the results to be very successful.“
”As a Siemens research and development department in the field of mechatronic systems and power electronics components, we are active in the testing of new technology. Our joint work with IMMS in the VE-VIDES project was an important aspect of our research and development. Together, we were able to utilise a RISC-V-based ASIC developed at IMMS to evaluate force sensors. IMMS contributed its expertise in designing trustworthy design structures and led the coordination between the partners to ensure a seamless integration of the work in the consortium.
The close cooperation with IMMS was characterised by a practical and application-oriented approach. This collaboration enabled us to unlock the full potential of the joint funding project and achieve a successful result, which was proven by a system demonstrator.
The partnership has exceeded our expectations and we consider the results to be very successful. The cooperation with IMMS was not only important for the project itself, but also for potential future research and development work.
We see the exchange and collaboration with IMMS as an important step towards developing innovative solutions in trustworthy electronics.“
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Contact
Contact
Eric Schäfer, M. Sc.
Head of Microelectronics / Branch Office Erfurt
eric.schaefer(at)imms.de+49 (0) 361 663 25 35
Eric Schäfer and his team research Integrated sensor systems, especially CMOS-based biosensors, ULP sensor systems and AI-based design and test automation. The results are being incorporated into research on the lead applications Sensor systems for in-vitro diagnostics and RFID sensor technology. It will assist you with services for the development of Integrated circuits and with IC design methods.