Skip to main content

Project VE-ARiS

IMMS developed copy protection solutions for integrated circuits to secure the know-how of partners

Counterfeits and copies as a risk for safety-critical systems and economic assets

Copied chips are a problem for manufacturers and users. Manufacturers or design houses design innovative chips with a great deal of expertise and financial investment and suffer economic damage with every copy of these chips. Users cannot rely on the performance parameters of the originals when dealing with copies and therefore potentially risk the safety of their own products.

The copies are created in various ways: a chip can be “rebuilt” on the basis of the data sheet, i.e. a new chip design with approximately the same properties is created. If the circuits themselves are to be imitated, the chips are often analysed using various methods to reproduce the internal structure. In some cases, the chips are polished in small steps and photographed under a microscope and the layouts required for production are then redrawn using these images.

Validation of methods on systems of industrial partners

In the ARiS project, IMMS has researched methods to make this copying more difficult and thus protect chips against it. Two research directions were pursued: A watermark that can be used to mark original chips was investigated to prevent copying. As with banknotes, a check is incorporated to identify an original. Attacks, such as the delayering of chips, were also the focus of the work. A machine-learning-based attack model was developed at IMMS with which this reverse engineering process can be simulated. On this basis, circuit components can be found that are easy to copy and can be “hardened” in the next step. This involves using structures that are difficult to recognise. The investigated approaches to copy protection were successfully validated using various demonstrators.

Acronym / Name:

VE-ARiS / Joint project: Electronic know-how protection for innovative sensor systems – ARiS

Duration:2021 – 2024

Application:

|IC design| chip design| design methodology| AI| machine learning| models| modelling| design support

Research field:Integrated sensor systems


Related content

Portrait photo

Reference

Dr. Heiner Flocke, iC-Haus GmbH

”By sharing expertise and resources, we were able to jointly develop a solution that met and even exceeded the requirements.“

Reference
All publicationsVE-ARiS

Event,

Days of trustworthy electronics 2024

Presentations of the results of the research projects of the funding guidelines for trustworthy electronics (ZEUS) and future-proof special processors and development platforms (ZuSE) of the Federal Ministry of Education and Research (BMBF)

Event,

Vertrauenswürdige Elektronik 2022

Digital Conference of the Federal Ministry of Education and Research (BMBF) on trustworthy electronics

Press release,

Reliable and faster chip designs through invasive and parametric simulation methods

Dissertation on new methods for automation in integrated circuit design

Press release,

Electronic know-how protection for innovative sensor systems

iC-Haus, IMMS and Wachendorff launch BMBF joint project VE-ARiS


Contact

Contact

Eric Schäfer, M. Sc.

Head of Microelectronics / Branch Office Erfurt

eric.schaefer(at)imms.de+49 (0) 361 663 25 35

Eric Schäfer and his team research Integrated sensor systems, especially CMOS-based biosensors, ULP sensor systems and AI-based design and test automation. The results are being incorporated into research on the lead applications Sensor systems for in-vitro diagnostics and RFID sensor technology. It will assist you with services for the development of Integrated circuits and with IC design methods.


Funding

The VE-ARiS project was funded by the Federal Ministry of Research, Technology and Space (BMFTR) under the reference 16ME0242.


This might also be interesting for you

Core topic

AI-based design and test automation

We are researching to use AI to make the development process of integrated sensor systems safer and more cost-effective. AI can help developers in the process to avoid errors and apply informal knowledge in an automated way.

Service for R&D

IC design methods

We develop new AI-based methods and tools for your system-on-chip and FPGA designs to master the increasing complexity of integrated systems and thus further increase performance.

Service for R&D

Integrated Circuits

We offer the design and realisation of application-specific integrated circuits (ASICs) in CMOS, BiCMOS and SOI technologies. We achieve well-performing ASICs with our first runs (first-time right silicon).

Research field

Integrated sensor systems

Here we investigate miniaturised systems manufactured in semiconductor technology consisting of microelectronic components for sensors applications, as well as methods to design these highly complex systems efficiently and safely.

Back