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2180 Ergebnisse
Referenz
  721. Power to the Model: Generating Energy-Aware Mixed-Signal Models using Machine Learning  
Martin Grabmann, Frank Feldhoff, Georg Gläser, Lausanne, Switzerland 2019 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Referenz
  722. Will There be Light? - Simulative Prediction of Fluorescence Measurements  
Florian Kögler, Alexander Hofmann, Georg Gläser, Lausanne, Switzerland 2019 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Referenz
  723. Efficient Design and Layout of Capacitive 3D Accelerometer  
Steffen Michael, Ralf Sommer, Lausanne, Switzerland 2019 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Referenz
  724. Analysis and Optimization of Power Supply Rejection for Power Management Unit Design in RFID Sensor applications  
Jun Tan, Ralf Sommer, Lausanne, Switzerland 2019 2019 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Referenz
  725. Design of a Capacitive Humidity Sensor Frontend with an Adaptive Resolution for Energy Autonomous Applications  
Maximilian Wiener, Benjamin Saft, Lausanne, Switzerland 2019 2019 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)  
Veranstaltung
  726. SMACD + PRIME 2019  
5 Vorträge auf der International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design und einen Vortrag auf der 15th Conference on PhD Research in Microelectronics and Electronics  
Referenz
  727. A modular application specific active test environment for high-temperature wafertest up to 300 °C  
Michael Meister, Marco Reinhard, St. Anne’s College in the University of Oxford, Oxford, United Kingdom 2019 International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019)  
Referenz
  728. Modular Desktop Platform for High-Temperature Characterization and Test up to 300°C  
Tom Reinhold, Björn Bieske, Georg Gläser, Michael Meister, St. Anne’s College in the University of Oxford, Oxford, United Kingdom 2019 International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019)  
Pressemitteilungen
  729. SONOTEC und IMMS belegen Platz 3 beim TÜV SÜD Innovationspreis 2019  
Auszeichnung für digitales mobiles Ultraschallprüfgerät SONAPHONE zur Instandhaltung 4.0.  
Suchergebnis 721 bis 730 von 2180