441. Efficient Design and Layout of Capacitive 3D Accelerometer   Steffen Michael, Ralf Sommer 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lausanne, Switzerland, 15 - 18 July 2019, pp. 225-228. DOI: https://doi.org/10.1109/SMACD.2019.8795280  

  442. Will There be Light? - Simulative Prediction of Fluorescence Measurements   Florian Kögler, Alexander Hofmann Georg Gläser 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lausanne, Switzerland, 15 - 18 July 2019, pp. 157-160. DOI: https://doi.org/10.1109/SMACD.2019.8795225  

  443. Power to the Model: Generating Energy-Aware Mixed-Signal Models using Machine Learning   Martin Grabmann, Frank Feldhoff Georg Gläser 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lausanne, Switzerland, 15 - 18 July 2019, pp. 5-8. DOI: https://doi.org/10.1109/SMACD.2019.8795295  

  444. Modeling of Low-dropout Regulator to Optimize Power Supply Rejection in System-on-Chip Applications   Jun Tan, Ralf Sommer 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lausanne, Switzerland, 15 - 18 July 2019, pp. 113-116. DOI: https://doi.org/10.1109/SMACD.2019.8795239  

  445. Analysis and Optimization of Power Supply Rejection for Power Management Unit Design in RFID Sensor applications   Jun Tan, Ralf Sommer 2019 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lausanne, Switzerland, 15 - 18 July 2019, pp. 181-184. DOI: https://doi.org/10.1109/SMACD.2019.8795258  

  446. Design of a Capacitive Humidity Sensor Frontend with an Adaptive Resolution for Energy Autonomous Applications   Maximilian Wiener, Benjamin Saft 2019 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 15 - 18 July 2019, Lausanne, Switzerland, 2019, pp. 137-140, DOI: https://doi.org/10.1109/PRIME.2019.8787836  

  447. A modular application specific active test environment for high-temperature wafertest up to 300 °C   Michael Meister, Marco Reinhard International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019), 8 - 10 July 2019, St. Anne’s College in the University of Oxford, Oxford, United Kingdom, DOI: https://doi.org/10.4071/2380-4491.2019.HiTen.000122  

  448. Modular Desktop Platform for High-Temperature Characterization and Test up to 300°C   Tom Reinold, Björn Bieske Georg Gläser Michael Meister International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019), 8 -10 July 2019, St. Anne’s College in the University of Oxford, Oxford, United Kingdom, DOI: https://doi.org/10.4071/2380-4491.2019.HiTen.000117