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Reference
  931. Design Methodology for Application-Specific Electromagnetic Energy Harvesters  
Bianca Leistritz, Wolfram Kattanek, Ilmenau 2017 59th Ilmenau Scientific Colloquium, Session 4.2. – Processes and Methods  
Event
  932. ISC 2017  
2 Lectures: 59th Ilmenau Scientific Colloquium – Engineering for a Changing World  
Reference
  933. Using Wireless Sensor Networks for Object Location and Monitoring  
Frank Senf, Silvia Krug, Tino Hutschenreuther, HAW Hamburg, Hamburg 2017 16. GI/ITG KuVS Fachgespräch "Sensornetze"  
Press release
  934. Silber und Bronze beim BVMW-Rodel-Cup 2017  
Mannschaftpokal fürs IMMS und zwei Plätze in der Einzelwertung der Damen  
Reference
  935. Sensor als Industrie-4.0-Komponente  
Björn Barig, BN Automation GmbH, Ilmenau 2017 Stammtisch "Sensorik 4.0"  
Reference
  936. Parasitic Symmetry at a Glance: Uncovering Mixed-Signal Layout Constraints  
Georg Gläser, Benjamin Saft, Ralf Sommer, Frankfurt on the Main, Germany 2017 FAC 2017, Frontiers in Analog CAD  
Event
  937. FGSN 2017  
16.GI/ITG KuVS Expert discussion „Sensor networks“  
Reference
  938. Michael Muth, AeroLas  
[Translate to English:] “We have for many years been appreciative of our cooperation with IMMS. The results from this project will be the basis of product design to the specification of future AeroLas customers. IMMS will likewise be an important partner for us in future developments because of its outstanding expertise in the field of magnetic drives.“  
Reference
  939. Dr. Dieter Treytnar, edacentrum  
“The idea became the edaBarCamp, a ‘non-conference’. As its name suggests, it was to be the first BarCamp in the field of EDA. It was organised by the edacentrum, IMMS and OFFIS. Thanks to the support given by IMMS on organisation and content, the first edaBarCamp was so successful that everybody agreed to repeat it in future years.”  
Reference
  940. Tobias Baumgartner, Pepperl+Fuchs  
“The systematic methods of IMMS in simulating the logic and steadily verifying all functions greatly contributed to the fact that we had an error-free chip in the very first iteration. It has been integrated into our mass-produced products since late 2016 and we are more than satisfied.”  
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