2169 results
Event
  901. ISSW 2026  
A circuit board with an unencapsulated microelectronic chip, leaving the bond wires and chip structures visible The International SPAD Sensor Workshop  
Event
  902. ISSW 2024  
Printed circuit board with microelectronic chip in a housing with microfluidic channels. The International SPAD Sensor Workshop & SPAD Sensor School  
Event
  903. ISSOM 2025  
International Summer School on Microelectronics  
Event
  904. ISPS 2018  
Lecture: Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors Authors: Ralf Lerner1, Klaus Heinrich1, Marco Erstling1, Peter Kornetzky2 1X-FAB Semiconductor Foundries GmbH, Erfurt, Germany 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany  
Event
  905. ISMB 2014  
 
Event
  906. ISEF 2019  
19th edition of International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering  
Event
  907. ISCAS 2020  
IEEE International Symposium on Circuits and Systems  
Event
  908. ISC 2017  
2 Lectures: 59th Ilmenau Scientific Colloquium – Engineering for a Changing World  
Press release
  909. IRIS®II – Bionic vision system to compensate for blindness – microelectronics for a retinal implant  
IMMS presents Pixium Vision‘s epi-retinal system at MEDICA, Nov 13th – 16th, Hall 3/G60  
Reference
  910. IRIS  
A procedure for in-line inspection of encapsulated MEMS silicon components  
Search results 901 until 910 of 2169