2185 results
Event
  901. IT-Leistungsschau  
 
Event
  902. IT-KoM 2026  
Two people next to an exhibition wall and behind a table with electronics and information material. Careers Fair for the Applied Computer Science Department at Erfurt University of Applied Sciences  
Event
  903. IT-KOM 2025  
Two people next to an exhibition wall and behind a table with electronics and information material. Contact fair of the Applied Computer Science department at the FH Erfurt University of Applied Sciences  
Event
  904. IT-KOM  
Two people next to an exhibition wall and behind a table with electronics and information material. Career Fair of the Applied Computer Science Department, University of Applied Sciences Erfurt  
Event
  905. ISSW 2026  
A circuit board with an unencapsulated microelectronic chip, leaving the bond wires and chip structures visible The International SPAD Sensor Workshop  
Event
  906. ISSW 2024  
Printed circuit board with microelectronic chip in a housing with microfluidic channels. The International SPAD Sensor Workshop & SPAD Sensor School  
Event
  907. ISSOM 2025  
International Summer School on Microelectronics  
Event
  908. ISPS 2018  
Lecture: Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors Authors: Ralf Lerner1, Klaus Heinrich1, Marco Erstling1, Peter Kornetzky2 1X-FAB Semiconductor Foundries GmbH, Erfurt, Germany 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany  
Event
  909. ISMB 2014  
 
Event
  910. ISEF 2019  
19th edition of International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering  
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