ISSOM 2025
“Before It Hits the Chip: A Gentle Introduction to Mixed-Signal IC Verification”
Martin Grabmann
At ISSOM25, students can explore the whole lifecycle of a chip, from concept to circuit, including chipdesign and microelectronics. IMMS supports this event with the lecture “Before It Hits the Chip: A Gentle Introduction to Mixed-Signal IC Verification” by Martin Grabmann. This topic is an important part of the lifecycle of a chip.
Who can attend?
- Bachelor's students nearing the end of their studies and still exploring their specialisation
- Early master’s students already focused on microelectronics and looking to broaden their horizon
Why attend?
- Explore the lifecycle of a chip, from concept to circuit
- Engage with experts from academia and industry through lectures, hands-on sessions, and keynotes
- Understand real-world applications in fields like healthcare, AI, and automotive
- Connect with students from across the world and build your network
Organiser: Leibniz Universität Hannover
Scientific ISSOM25 partners:
- Leibniz Universität Hannover
- Technische Universität Braunschweig
- IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH)
- RWTH Aachen University
- Technische Universität Wien
- FMD - Forschungsfabrik Mikroelektronik Deutschland
Promoted and funded by:
Chipdesign Germany – the central network to promote the education and training of talent, to monitor technological developments and to support start-ups and SMEs in microelectronics. The Chipdesign Germany project is funded by the Federal Ministry of Research, Technology and Space (BMFTR).
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Core topic
AI-based design and test automation
We are researching to use AI to make the development process of integrated sensor systems safer and more cost-effective. AI can help developers in the process to avoid errors and apply informal knowledge in an automated way.
Service for R&D
IC design methods
We develop new AI-based methods and tools for your system-on-chip and FPGA designs to master the increasing complexity of integrated systems and thus further increase performance.
Service for R&D
Integrated Circuits
We offer the design and realisation of application-specific integrated circuits (ASICs) in CMOS, BiCMOS and SOI technologies. We achieve well-performing ASICs with our first runs (first-time right silicon).
Research field
Integrated sensor systems
Here we investigate miniaturised systems manufactured in semiconductor technology consisting of microelectronic components for sensors applications, as well as methods to design these highly complex systems efficiently and safely.
Contact
Contact
Dipl.-Hdl. Dipl.-Des. Beate Hövelmans
Head of Corporate Communications
beate.hoevelmans(at)imms.de+49 (0) 3677 874 93 13
Beate Hövelmans is responsible for the text and image editorial work on this website, for the social media presence of IMMS on LinkedIn and YouTube, the annual reports, for press and media relations with regional and specialist media and other communication formats. She provides texts, photographs and video material for your reporting on IMMS, arranges contacts for interviews and is the contact person for events.