1769 results
Service for R&D
  891. IC design methods  
Service for R&D: IC design methods. We develop new AI-based methods and tools for your system-on-chip and FPGA designs to master the increasing complexity of integrated systems and thus further increase performance.  
Reference
  892. Hybrid scheme to enable DTN routing protocols to efficiently exploit stable MANET contacts  
Silvia Krug, Matthias Aumüller Jochen Seitz EURASIP Journal on Wireless Communications and Networking, Volume 2018, Article number: 237 (2018), https://doi.org/10.1186/s13638-018-1248-5  
Reference
  893. HW/SW-Co-Entwurf einer intelligenten Sensor-Schnittstelle mit Hilfe eines schnellen, Zyklenzahl-genauen, RTL-nahen Befehlssatz-Simulators  
Gregor Nitsche, Eckhard Hennig Georg Gläser 15. Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV), 2012, Kaiserslautern, 05.03.2012-07.03.2012  
Reference
  894. HTS SFQ circuit design  
H.Töpfer, Hitachi Central Research Laboratory, 14.11.2002, Tokyo, Japan  
Reference
  895. HTS Multilayer Technology for Optimal Bit-Error Rate RSFQ Cells  
D. Cassel, Th.Ortlepp K.S.Ilin G.Pickartz B.Kuhlmann R.Dittmann H. Töpfer IEEE Trans. Appl. Supercond., 13(2003) 2, S. 409-412  
Reference
  896. HoTSens  
Integrated sensors and microelectronics operate at 300°C, enabling more efficient processes  
Reference
  897. Hot Fuzz: Assisting verification by fuzz testing microelectronic hardware  
Henning Siemen, Jonas Lienke Georg Gläser 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Funchal, Portugal, July 03-05, 2023, pp. 1-4, DOI: https://doi.org/10.1109/SMACD58065.2023.10192176  
Reference
  898. Hörbarmachung von Ultraschallsignalen  
Peter Holstein, Nicki Bader A. Tharandt R. John S. Uziel D. Januszko T. Hutschenreuther Fortschritte der Akustik - DAGA 2016, 42. Jahrestagung für Akustik, 14.-17. März 2016  
Reference
  899. HoLoDEC  
Close-up of a milling machine to which an approximately 2 x 2 cm small wireless circuit board with sensors and an illuminated LED is held. IMMS researches ultra-low-power architectures (ULP) and circuit concepts as well as energy-efficient edge-AI systems with overall system energy modeling  
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