2013 Jahresbericht | Fachartikel MEMS-T-Lab (en/de)
MEMS-T-Lab – 44 a new test lab for MEMS-based micro systems Micro-electrical mechanical systems (MEMS) are no more than a few micrometres in size. They unite sensors, actuators and control electronics onto a single silicon chip in a compact arrangement and are formed direct on the wafer: a method developed for MEMS production which originates in semiconductor manufacture. One use of these tiny systems is to control inkjet printer heads, another is as the microphone in a smartphone, another is as a sensor for the orientation of a…
2013 Jahresbericht | Fachartikel SFB622 (en/de)
SFB 622 – on the track of the nanometre To look at even the cell-phones and USB sticks of yesterday and of today is to see how fast technology has developed over recent years. In an ever smaller volume is to be found ever higher computing capacity and/or ever more memory. It is the continuous reduction in the size of the structural elements of electronic chips that makes all this possible. To take one example, the computing core of the current iPhone 5s contains components which at their smallest have dimensions of 28 nanometres. And not only…
2014 Jahresbericht | Fachartikel 4TPixel (en/de)
4TPixel – ASIC Development for Radiography IMMS developed a readout circuit for a novel pixel cell and provides low-noise high-quality recordings for X-ray photographs. Photograph: Objectives 48 IMMS. To improve both diagnostics and treatment options for patients, further development has been taking place for many decades in such imaging methods as radiography, computer tomography (CT) and magnetic resonance imaging (MRI). CMOS image sensors (CIS) have long been established in medical technology. They are semi-conductor structures which…
Annual Report 2014
A n n u a l R e p o rt 2014 Publishing Details Contents Publisher IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH* Design, Typography and Photography Dipl.-Hdl. Dipl.-Des. Beate Hövelmans Information Graphics and Image Processing Dipl.-Hdl. Dipl.-Des. Beate Hövelmans Danielle Warnecke, B.A. Nicole Brühl, B.A. Ehrenbergstraße 27 98693 Ilmenau Germany Printed by Brandtdruck e.K., www.brandtdruck.de +49.3677.87493.00 Phone +49.3677.87493.15 Fax imms@imms.de www.imms.de All rights reserved. Reproduction and publication only with express…
2014 Jahresbericht | Fachartikel EROLEDT (en/de)
EROLEDT OLED driver circuit for energy efficient lighting Instruments used in the IMMS laboratory for the characterisation of the Objectives OLED driver developed at the Institute. The ASIC, laid out specifically for the OLED panel, enables it to run efficiently and compensates for the ”Organic LEDs“, or OLEDs*, have been used for some years already in smartphones and television screens. At the moment, they are not in common use for general lighting purposes. An OLED is, however, highly efficient in its use of energy and about 60% more…
2014 Jahresbericht | Fachartikel GreenSense Bio ASICs (en/de)
Semiconductor-based biochips for on-site veterinary diagnosis Test card equipped with an ASIC capable of analysing aqueous solutions applied directly to the chip. Photograph: IMMS. Objectives 50 Regular health testing of farm animals is a necessity for high-standard food supplies. Up to now, veterinary diagnosis has been possible only after several days or even weeks because it has been necessary to send off samples to a laboratory where they are prepared for and subjected to microbiological analysis. In cases where a…
2014 Jahresbericht | Fachartikel GreenSense Energy Harvesting (en/de)
Energy harvesting for autonomous sensor systems For purposes of combining an electromagnetic generator with their wireless sensor nodes, IMMS scientists made and investigated various har- 18 Objectives vester circuits, one of which is shown here being tested on a shaker in Among the building blocks for Industry 4.0 will be cyber-physical systems, as they are called, which contain finely distributed, networked sensors. All over the world, for about fifteen years, research has been carried out into the ecologically…
Jahresbericht 2014
Jahresbericht 2014 Impressum Inhalt Herausgeber IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH Gestaltung, Satz und Fotografie Dipl.-Hdl. Dipl.-Des. Beate Hövelmans Grafik und Bildbearbeitung Dipl.-Hdl. Dipl.-Des. Beate Hövelmans Danielle Warnecke, B.A. Nicole Brühl, B.A. Ehrenbergstraße 27 98693 Ilmenau Germany Druck Brandtdruck e.K., www.brandtdruck.de +49.3677.87493.00 Telefon +49.3677.87493.15 Fax imms@imms.de www.imms.de Alle Rechte sind vorbehalten. Vervielfältigung und Veröffentlichung nur mit Genehmigung der IMMS GmbH. …
2014 Jahresbericht | Fachartikel MEMS2015 MEMS-Cantilever-ASIC (en/de)
Readout circuit for a smart force sensor MEMS The ASIC developed by IMMS is part of a compact sensor head capable of measuring surface quality at a resolution of less than 100 nanometres in Objectives the industrial setting. Photograph: IMMS. Because microsystems technology is advancing so fast, particularly in the trend towards ever larger wafer diameters, and ever smaller components, the challenges confronting process monitoring and qual ity tests for microsystems are ever greater. In the at tempt to minimise…
