1755 results
Reference
  881. Identification of Critical Scenarios in AMS Verification: Methodology for Finding the Safe Operating Area of AMS Systems  
Georg Gläser, Hyun-Sek Lukas Lee Markus Olbrich Erich Barke Eckhard Hennig 2016 Design, Automation & Test in Europe (DATE), 14 – 18 March 2016, University Booth, Embedded Tutorial: Analog-/Mixed-Signal Verification Methods for AMS Coverage Analysis, Dresden, Germany  
Reference
  882. IC-Entwicklung: Effizientere Simulation mit KI-basierter Modellfehlerschätzung  
Henning Siemen, Martin Grabmann Eric Schäfer Georg Gläser Elektronik, 17-18/2023, 23. August 2023, Seite 66 - 69, ePaper: https://wfm-publish.blaetterkatalog.de/frontend/mvc/catalog/by-name/ELE?catalogName=ELE2317D  
Service for R&D
  883. IC design methods  
Service for R&D: IC design methods. We develop new AI-based methods and tools for your system-on-chip and FPGA designs to master the increasing complexity of integrated systems and thus further increase performance.  
Reference
  884. Hybrid scheme to enable DTN routing protocols to efficiently exploit stable MANET contacts  
Silvia Krug, Matthias Aumüller Jochen Seitz EURASIP Journal on Wireless Communications and Networking, Volume 2018, Article number: 237 (2018), https://doi.org/10.1186/s13638-018-1248-5  
Reference
  885. HW/SW-Co-Entwurf einer intelligenten Sensor-Schnittstelle mit Hilfe eines schnellen, Zyklenzahl-genauen, RTL-nahen Befehlssatz-Simulators  
Gregor Nitsche, Eckhard Hennig Georg Gläser 15. Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV), 2012, Kaiserslautern, 05.03.2012-07.03.2012  
Reference
  886. HTS SFQ circuit design  
H.Töpfer, Hitachi Central Research Laboratory, 14.11.2002, Tokyo, Japan  
Reference
  887. HTS Multilayer Technology for Optimal Bit-Error Rate RSFQ Cells  
D. Cassel, Th.Ortlepp K.S.Ilin G.Pickartz B.Kuhlmann R.Dittmann H. Töpfer IEEE Trans. Appl. Supercond., 13(2003) 2, S. 409-412  
Reference
  888. HoTSens  
Integrated sensors and microelectronics operate at 300°C, enabling more efficient processes  
Reference
  889. Hot Fuzz: Assisting verification by fuzz testing microelectronic hardware  
Henning Siemen, Jonas Lienke Georg Gläser 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Funchal, Portugal, July 03-05, 2023, pp. 1-4, DOI: https://doi.org/10.1109/SMACD58065.2023.10192176  
Reference
  890. Hörbarmachung von Ultraschallsignalen  
Peter Holstein, Nicki Bader A. Tharandt R. John S. Uziel D. Januszko T. Hutschenreuther Fortschritte der Akustik - DAGA 2016, 42. Jahrestagung für Akustik, 14.-17. März 2016  
Search results 881 until 890 of 1755