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Reference
  821. Modeling Pitch Perception With an Active Auditory Model Extended by Octopus Cells  
Tamas Harczos, Frank Markus Klefenz, 2018 Front. Neurosci.  
Event
  822. 19. Heiligenstädter Kolloquium  
 
Event
  823. Mittelstand 4.0-Regionalkonferenz  
 
Reference
  824. Mittels neuer Denk- und Arbeitsweise neue Produkte, Dienste und Geschäftsmodelle entwickeln  
Jörg Weber, Augustinerkloster, Erfurt 2018 Mittelstand 4.0-Regionalkonferenz, „Arbeit 4.0 konkret – Wie verändert die Digitalisierung unsere Arbeitswelt?“, Workshop „Design Thinking – eine praktische Einführung  
Reference
  825. Design of Quasi-synchronous Finite State Machines Using a Local On-demand Clocking Approach  
Athanasios Gatzastras, Dominik Wrana, Tobias Wolfer, Georg Gläser, Benjamin Saft, Eric Schäfer, Eckhard Hennig, München-Neubiberg 2018 Analog 2018, 16. GMM/ITG-Fachtagung  
Reference
  826. Effizientes Design und Layout von 3D Beschleunigungssensoren mittels automatisierter Synthese  
Steffen Michael, Maria Kellner, Ralf Sommer, München-Neubiberg 2018 Analog 2018, 16. GMM/ITG-Fachtagung  
Event
  827. Analog 2018  
16. GMM/ITG-Fachtagung  
Event
  828. FDL 2018  
Lecture at the conference ”Forum on specification & Design Languages“: Session 1, Event-driven Modeling and Simulation, Monday 10, September 2018, 15:00 pm - 16:30 pm From Low-Power to No-Power: Adaptive Clocking for Event-Driven Systems Authors: Georg Gläser1 , Benjamin Saft1, Dominik Wrana2 , Athanasios Gatzastras2 , and Eckhard Hennig2 1IMMS Institut fürMikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ilmenau, Germany 2Reutlingen University, Reutlingen, Germany  
Reference
  829. Design and Performance of Power Amplifier Integration with BAW Filter on a Silicon-Ceramic Composite and Standard Epoxy/Glass Substrate  
Vikrant Chauhan, Wilfried Wandji, Xuejiao Peng, Victor Silva Cortes, Astrid Frank, Michael Fischer, Uwe Stehr, Robert Weigel, Amelie Hagelauer, Ann Arbor, MI, USA 2018 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)  
Reference
  830. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors  
Ralf Lerner, Klaus Heinrich, Marco Erstling, Peter Kornetzky, Prague, Czech Republic 2018 14th International Seminar on Power Semiconductors (ISPS)  
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