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Reference

2101. Thermal Analysis of a Coil Assembly in a Nanopositioning Drive System via Reduced-Complexity CFD Modeling

Ina Naujokat, Ludwig Herzog, Steffen Hesse, Parastoo Salimitari, 2026 Applied Sciences

Reference

2102. Understanding optically detected magnetic resonance (ODMR) of InSi-Sii-defects

Kevin Lauer, Bernd Hähnlein, Mario Bähr, Kai Kühnlenz, Philipp Kellner, Dirk Schulze, Stefan Krischok, Alexander Rolapp, Christian Möller, Thomas Ortlepp, Technische Universität Dresden, Dresden, Germany 2026 DPG-Frühjahrstagung (DPG Spring Meeting) of the Condensed Matter Section (SKM)

Event

2103. Microstructure User Meeting 2026

New 3D vibrometer system for MEMS. Photograph: IMMS.

Symposium on optical vibration measurement

Reference

2104. Parameter extraction such as layer thickness and stress at wafer level for process monitoring in semiconductor manufacturing

Steffen Michael, Waldbronn, Germany 2026 Microstructure User Meeting 2026, Symposium zur optischen Schwingungsmessung

Reference

2105. Information statt Daten – Möglichkeiten zur Sensordatenverarbeitung am Sensor oder in Edge-Systemen

Tino Hutschenreuther, Erfurt, Germany 2026 „Detect“ Netzwerktreffen

Event

2106. IEEE SSD 2026

Two hands hold circuit boards the size of euro coins with an LED in the centre.

The International Multi-Conference on Systems, Signals and Devices

Reference

2107. Very steep LED light pulses: a selection-guideline

Vincent Haude, Alexander Rolapp, Michael Meister, Catania, Italy 2026 2026 IEEE 23rd International Multi-Conference on Systems, Signals & Devices (SSD)

Reference

2108. Evaluation of triboelectric nanogenerators for low-frequency vibrations and their potential in wireless sensor networks

Marios Kaminiotis, Silvia Krug, Hannes Toepfer, Romain Noël, Julien Le Scornec, Vincent Le Cam, Bastien Chapuis, 2026 Smart Mater. Struct.

Research field

2109. Research

We connect the digital to the analog world. Photograph: IMMS.

Research: We conduct research to harness cutting-edge results from science for industry. Through application-oriented developments we strengthen industry's competitiveness with innovations.

Service for R&D

2110. Integrated Circuits

For our ASIC developments, we involve in-house test engineers and manufacturing partners right from the start. Photograph: IMMS.

Service for R&D: Integrated Circuits. We offer the design and realisation of application-specific integrated circuits (ASICs) in CMOS, BiCMOS and SOI technologies. We achieve well-performing ASICs with our first runs (first-time right silicon).