Microstructure User Meeting 2026
Parameter extraction such as layer thickness and stress at wafer level for process monitoring in semiconductor manufacturing
Steffen Michael
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Contact
Dipl.-Hdl. Dipl.-Des. Beate Hövelmans
Head of Corporate Communications
beate.hoevelmans(at)imms.de+49 (0) 3677 874 93 13
Beate Hövelmans is responsible for the text and image editorial work on this website, for the social media presence of IMMS on LinkedIn and YouTube, the annual reports, for press and media relations with regional and specialist media and other communication formats. She provides texts, photographs and video material for your reporting on IMMS, arranges contacts for interviews and is the contact person for events.