IMMS - Search

Event

201. Think Wireless IoT Day

Think Wireless IoT Day on Healthcare and Security

Reference

202. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors

Ralf Lerner, Klaus Heinrich, Marco Erstling, Peter Kornetzky, Prague, Czech Republic 2018 14th International Seminar on Power Semiconductors (ISPS)

Reference

203. THERMULAB

Microchip with an operating temperature of up to 150°C, developed by IMMS as part of the Thermulab project. Photograph: IMMS.

The developed highly accurate sensor system, operating at 150°C, improves the efficiency of industrial plants and combustion engines.

Reference

204. Thermal Modeling and Measurement of a Power Amplifier Module for a Silicon-Ceramic Substrate

Astrid Frank, Victor Silva Cortes, Steffen Michael, Amelie Hagelauer, Georg Fischer, Freiburg 2018 2018 11th German Microwave Conference (GeMiC)

Reference

205. Thermal Channel Noise of quarter and sub-quarter micron NMOS FET's

Reference

206. Thermal Analysis of a Coil Assembly in a Nanopositioning Drive System via Reduced-Complexity CFD Modeling

Ina Naujokat, Ludwig Herzog, Steffen Hesse, Parastoo Salimitari, 2026 Applied Sciences

Reference

207. There is a limit to everything: Automated AMS Operating condition check Generation on System Level

Georg Gläser, Gerrit Kropp, Andreas Fürtig, 2018 Integration

Reference

208. Themenkreis Virtual Test und automatische Testplangenerierung aus ATML

Reference

209. The sound of ultrasound

Nicki Bader, Peter Holstein, Hans-Joachim Münch, Sebastian Uziel, Tino Hutschenreuther, Steffen Seitz, Montréal, Canada 2019 26th International Congress on Sound and Vibration (ICSV26)

Reference

210. The Rapid Single-Flux Quantum Technology - a Promising Alternative for the Development of High-Performance Digital Electronics