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Event

1961. The Mile of Technology 2019

Details to follow.

Reference

1962. The Rapid Single-Flux Quantum Technology - a Promising Alternative for the Development of High-Performance Digital Electronics

B. Dimov, T. Ortlepp H. F. Uhlmann Kleinheubacher Tagung 2007, 24.-27. September 2007, Miltenberg

Reference

1963. The sound of ultrasound

Nicki Bader, Peter Holstein Hans-Joachim Münch Sebastian Uziel Tino Hutschenreuther Steffen Seitz 26th International Congress on Sound and Vibration (ICSV26), 7 - 11 July 2019, Montréal, Canada, ISBN: 9781510892699

Reference

1964. Themenkreis Virtual Test und automatische Testplangenerierung aus ATML

D. Glaser, P. Lu K. Helmreich I. Gryl M. Meister A. Lechner M. Jegler Z. Kiss Virtuelle Instrumente in der Praxis VIP 2010, 27.10.-28.10.2010, München, Proceedings

Reference

1965. There is a limit to everything: Automated AMS Operating condition check Generation on System Level

Georg Gläser, Martin Grabmann Gerrit Kropp Andreas Fürtig Integration, Volume 63, 2018, Pages 383-391, ISSN 0167-9260, DOI: https://doi.org/10.1016/j.vlsi.2018.02.016

Reference

1966. Thermal Analysis of a Coil Assembly in a Nanopositioning Drive System via Reduced-Complexity CFD Modeling

Ina Naujokat, Ludwig Herzog Steffen Hesse Parastoo Salimitari Applied Sciences 2026, 16, 2748. DOI: https://doi.org/10.3390/app16062748

Reference

1967. Thermal Channel Noise of quarter and sub-quarter micron NMOS FET's

G. Knoblinger, P. Klein U. Baumann ICMTS 2000, USA, CA, Monterey, März 2000

Reference

1968. Thermal Modeling and Measurement of a Power Amplifier Module for a Silicon-Ceramic Substrate

Astrid Frank, V. Silva Cortes Steffen Michael A. Hagelauer G. Fischer 2018 11th German Microwave Conference (GeMiC), Freiburg, 12-14 March 2018, pp. 79-82. DOI: https://doi.org/10.23919/GEMIC.2018.8335033

Reference

1969. THERMULAB

Microchip with an operating temperature of up to 150°C, developed by IMMS as part of the Thermulab project. Photograph: IMMS.

The developed highly accurate sensor system, operating at 150°C, improves the efficiency of industrial plants and combustion engines.

Reference

1970. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors

Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic