1769 results
Reference
  1611. THERMULAB  
The developed highly accurate sensor system, operating at 150°C, improves the efficiency of industrial plants and combustion engines.  
Reference
  1612. Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors  
Ralf Lerner, Klaus Heinrich Marco Erstling Peter Kornetzky 14th International Seminar on Power Semiconductors (ISPS), 29-31 August 2018, Prague, Czech Republic  
Reference
  1613. Thomas Freitag, Melexis  
”For many years, IMMS has been supporting us in the development and refinement of our ICs, among them those for LIN-based regulation of RGB LEDs. It is our intention to collaborate again with the Institute in the future, continuing to rely on its skills.“  
Reference
  1614. thurAI  
In thurAI, IMMS is working on sensor technology for SmartCity and methods to intelligently process data in the network for AI evaluations.  
Press release
  1615. Thuringian project develops novel technology platform for the detection of SARS-CoV-2  
Change in electrical conductivity visualises virus material  
Reference
  1616. Timing Accurate Synthesis of Digital SystemC Components in a Mixed-Signal Environment  
Georg Gläser, Eckhard Hennig CDNLive2014, 19.05.2014 - 21.05.2014, München, Poster  
Reference
  1617. Tip- and laser-based nanofabrication up to 100 mm with sub-nanometre precision  
Ingo Ortlepp, Michael Kühnel, Martin Hofmann, Laura Weidenfeller Johannes Kirchner, Shraddha Supreeti Rostyslav Mastylo, Mathias Holz Thomas Michels, Roland Füßl Ivo W. Rangelow, Thomas Fröhlich Denis Dontsov Christoph Schäffel Eberhard Manske Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 113240A (23 March 2020), DOI: https://doi.org/10.1117/12.2551044  
Reference
  1618. Tip-based nanofabrication below 40 nm combined with a nanopositioning machine with a movement range of Ø100 mm  
Jaqueline Stauffenberg, Michael Reibe Anja Krötschl Christoph Reuter Ingo Ortlepp Denis Dontsov Steffen Hesse Ivo W. Rangelow Steffen Strehle Eberhard Manske Micro and Nano Engineering, Volume 19, 2023, 100201, ISSN 2590-0072, DOI: https://doi.org/10.1016/j.mne.2023.100201  
Reference
  1619. Tip‑ and Laser‑based 3D Nanofabrication in Extended Macroscopic Working Areas  
Ingo Ortlepp, Thomas Fröhlich, Roland Füßl et al., Nanomanufacturing and Metrology 4, 132–148 (2021). DOI: https://doi.org/10.1007/s41871-021-00110-w  
Reference
  1620. Tobias Baumgartner, Pepperl+Fuchs  
“The systematic methods of IMMS in simulating the logic and steadily verifying all functions greatly contributed to the fact that we had an error-free chip in the very first iteration. It has been integrated into our mass-produced products since late 2016 and we are more than satisfied.”  
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