2149 results
Reference
  1081. DE 10 2013 114 046  
Electronic delay circuit in CMOS technology  
Event
  1082. Symposium ”Sense. Enable. SPITSE. 2015“  
3 contributions to the Second International Scientific Symposium ”Sense. Enable. SPITSE. 2015“, St. Petersburg Electrotechnical University ”LETI“, St. Petersburg, Russia  
Reference
  1083. ANCONA  
Computer-aided verification methods have been developed to accelerate the design of Industry 4.0 applications.  
Media library
  1084. Final report Anubis 2014  
Abschlussbericht Anubis 2014 Inhaltsverzeichnis 1 Einleitung 1.1 Forschungsthema . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Projektablauf . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 5 7 2 Stand von Wissenschaft und Technik 2.1 Passive Maßnahmen zur Reduktion des Energieverbrauchs . . . . . . . . . . . . . . . . 2.2 Aktive Maßnahmen zur Reduktion des Energieverbrauchs . . . . . . . . . . . . . . . . . 2.3…  
Reference
  1085. Sensor-/Aktornetzwerke für Industrie-4.0-Anwendungen  
Tino Hutschenreuther, Thüringer Maschinenbautag des Thüringer Zentrums für Maschinenbau (ThZM), 10.06.2015, Messe, Erfurt  
Event
  1086. Thüringer Maschinenbautag  
 
Reference
  1087. Seamless Design Methodology for heterogeneous Systems – Challenges for research, education, industry and EDA  
Ralf Sommer, Design Automation Conference (DAC), 07. – 11.06.2015, Panel: "The needs and expectations of a fruitful industrial and academic cooperation", San Francisco, USA  
Event
  1088. DAC 2015  
Invited Talk: “Seamless Design Methodology for heterogeneous Systems – Challenges for research, education, industry and EDA” Panel: “The needs and expectations of a fruitful industrial and academic cooperation”  
Reference
  1089. DE 10 2013 113 378  
Method and electronic circuit for determining the time instant of an extremum of a time-varying capacitance  
Media library
  1090. 2009 Annual Report | Article PMS380 (en/de)  
2009 Jahresbericht | Fachartikel PMS380 (en/de) LASER DICING TECHNOLOGY FOR THIN SEMICONDUCTOR WAFERS PLANAR PRECISION DRIVE FOR 12 INCH WAFER DICING „As a result of competent and creative collaboration, at the end of 2009, the company ALSI was able to take the first prototype of its new 12 inch laser dicing platform into operation. The achieved extreme precision, reproducibility and productivity of the laser dicing technology are at the forefront of international excellence. This is significantly boosted by the planar drive system developed by the IMMS. The close cooperation with the IMMS…  
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