M. Fischer,
T. Welker
B. Leistritz
S. Gropp
C. Schäffel
M. Hoffmann
J. Müller
Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT): May 2016, Vol. 2016, No. CICMT, pp. 000107-000110, DOI: http://dx.doi.org/10.4071/2016CICMT-WA22