Current Publication
Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration
Michael Fischer1, Sebastian Gropp2, Johannes Stegner3, Astrid Frank4, Martin Hoffmann2, Jens Müller1
in IEEE Microwave Magazine, vol. 20, no. 10, Oct. 2019, pp. 28-43, 2019, DOI: doi.org/10.1109/MMM.2019.2928675
1Technische Universität Ilmenau, Institute of Micro- and Nanotechnologies (IMN) MacroNano®, Electronics Technology Group, Gustav-Kirchhoff-Straße 7, 98693 Ilmenau, Germany, 2Technische Universität Ilmenau, Institute of Micro- and Nanotechnologies (IMN) MacroNano®, Micromechanical Systems Group, Gustav-Kirchhoff-Straße 7, 98693 Ilmenau, Germany, 3Technische Universität Ilmenau, Institute of Micro- and Nanotechnologies (IMN) MacroNano®, RF and Microwave Research Group, Gustav-Kirchhoff-Straße 7, 98693 Ilmenau, Germany, 4IMMS Institut für Mikroelekronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), Ehrenbergstraße 27, 98693 Ilmenau, Germany
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MUSIK
IMMS has investigated, modelled and validated MEMS characteristics to develop basic blocks for a universally applicable method for MEMS design.
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