Patent DE 10 2013 205 255
Digital temperature sensor
The invention relates to a digital temperature sensor comprising a current source, a delay circuit for generating a PWM signal with a temperature-dependent duty cycle and a counter for converting the PWM signal into a digital output signal representing the measured value, wherein the delay circuit is temperature-sensitive and comprises a diode matrix which can be supplied via a single bias current, a switch and a comparator. The invention also relates to a method for operating a digital temperature sensor, wherein the temperature-dependent duty cycle of the PWM signal is generated by the ratio of a time interval to the duration of a constant time window by determining, within the constant time window, the time interval which begins when a voltage influenced by the temperature is reached during a charging process on one of the capacitors in a current path and ends when the voltage determined by the temperature is reached on a capacitor in a further current path connected in parallel with respect to the first current path.
Patent No.:DE 10 2013 205 255
Inventor:Jun Tan
Application:
Temperature monitoring| RFID sensorsResearch field:Integrated sensor systems
granted patent
Application date:26 März 2013
Date of first publication:02 Oktober 2014
Date of publication of grant:02 November 2017
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Contact
Contact
Eric Schäfer, M. Sc.
Head of Microelectronics / Branch Office Erfurt
eric.schaefer(at)imms.de+49 (0) 361 663 25 35
Eric Schäfer and his team research Integrated sensor systems, especially CMOS-based biosensors, ULP sensor systems and AI-based design and test automation. The results are being incorporated into research on the lead applications Sensor systems for in-vitro diagnostics and RFID sensor technology. It will assist you with services for the development of Integrated circuits and with IC design methods.
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Dr.-Ing. Ludwig Herzog
Head of Mechatronics
ludwig.herzog(at)imms.de+49 (0) 3677 874 93 60
Dr. Ludwig Herzog will provide detail on our research on magnetic 6D direct drives with nm precision for the nm measurement and structuring of objects. He supports you with services for the development of mechatronic systems, for simulation, design and test of MEMS as well as for finite element modelling (FEM) and simulation.
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Dr.-Ing. Tino Hutschenreuther
Head of System Design
tino.hutschenreuther(at)imms.de+49 (0) 3677 874 93 40
Dr. Tino Hutschenreuther will answer your questions on our research in Smart distributed measurement and test systems and the related core topics Analysis of distributed IoT systems, Embedded AI and Real-time data processing and communications, on the lead applications Adaptive edge AI systems for industrial application and IoT systems for cooperative environmental monitoring as well as on the range of services for the development of embedded systems.
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Here we investigate miniaturised systems manufactured in semiconductor technology consisting of microelectronic components for sensors applications, as well as methods to design these highly complex systems efficiently and safely.
Lead application
RFID sensor technology
We are researching energy-efficient solutions for RFID sensor technology in order to open up new applications and, for example, to make processes in industry more resource-efficient.