Annual Report 2014
A n n u a l R e p o rt 2014 Publishing Details Contents Publisher IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH* Design, Typography and Photography Dipl.-Hdl. Dipl.-Des. Beate Hövelmans Information Graphics and Image Processing Dipl.-Hdl. Dipl.-Des. Beate Hövelmans Danielle Warnecke, B.A. Nicole Brühl, B.A. Ehrenbergstraße 27 98693 Ilmenau Germany Printed by Brandtdruck e.K., www.brandtdruck.de +49.3677.87493.00 Phone +49.3677.87493.15 Fax imms@imms.de www.imms.de All rights reserved. Reproduction and publication only with express…
2014 Jahresbericht | Fachartikel GreenSense Energy Harvesting (en/de)
Energy harvesting for autonomous sensor systems For purposes of combining an electromagnetic generator with their wireless sensor nodes, IMMS scientists made and investigated various har- 18 Objectives vester circuits, one of which is shown here being tested on a shaker in Among the building blocks for Industry 4.0 will be cyber-physical systems, as they are called, which contain finely distributed, networked sensors. All over the world, for about fifteen years, research has been carried out into the ecologically…
2014 Jahresbericht | Fachartikel GreenSense Bio ASICs (en/de)
Semiconductor-based biochips for on-site veterinary diagnosis Test card equipped with an ASIC capable of analysing aqueous solutions applied directly to the chip. Photograph: IMMS. Objectives 50 Regular health testing of farm animals is a necessity for high-standard food supplies. Up to now, veterinary diagnosis has been possible only after several days or even weeks because it has been necessary to send off samples to a laboratory where they are prepared for and subjected to microbiological analysis. In cases where a…
2013 Jahresbericht | Fachartikel SFB622 (en/de)
SFB 622 – on the track of the nanometre To look at even the cell-phones and USB sticks of yesterday and of today is to see how fast technology has developed over recent years. In an ever smaller volume is to be found ever higher computing capacity and/or ever more memory. It is the continuous reduction in the size of the structural elements of electronic chips that makes all this possible. To take one example, the computing core of the current iPhone 5s contains components which at their smallest have dimensions of 28 nanometres. And not only…
