1031. Investigations of metal systems in a silicon ceramic composite substrate for electrical and thermal contacts as well as associated mounting aspects   M. Fischer, T. Welker B. Leistritz S. Gropp C. Schäffel M. Hoffmann J. Müller Ceramic Interconnect and Ceramic Microsystems Technologies, Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT): May 2016, Vol. 2016, No. CICMT, pp. 000107-000110, DOI: http://dx.doi.org/10.4071/2016CICMT-WA22  

  1034. Tri-Gate Al0.2Ga0.8N/AlN/GaN HEMTs on SiC/Si-substrates   Wael Jatal, Uwe Baumann Heiko O. Jacobs Frank Schwierz Jörg Pezoldt Materials Science Forum, ISSN: 1662-9752, Vol. 858, pp 1174-1177, DOI: http://www.scientific.net/MSF.858.1174, ©2016 Trans Tech Publications, Switzerland  

  1037. Intelligente Lösungen für Industrie 4.0 - Diagnose und Überwachung in industriellen Anlagen   Tino Hutschnreuther, 2. Maschinenbautag, 15.06.2016, Erfurt  

  1038. On the Role of Wireless Sensor Networks for Intelligent Transportation Systems   Silvia Krug, Jochen Seitz Elena Chervakova Hannes Toepfer Sense. Enable. SPITSE, 2016, 20.06.2016 - 24.06.2016, Moskau, Russland  

  1039. An Approach to Extract Significant Features for Vehicle Classification Based on Magnetic Field Sensor Data   Vladimir Shkoda, Sylvia Braeunig Marco Goetze Hannes Toepfer Sense. Enable. SPITSE, 2016, 20.06.2016 - 24.06.2016, Moskau, Russland  

  1040. Flexible Hardware/Softwareplattformen für intelligente Industrie 4.0-Geräte   Tino Hutschenreuther, Wolfram Kattanek elmug4future, Technologiekonferenz 2016, 21.06.2016, Friedrichroda