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Event
  911. IT-Leistungsschau  
 
Event
  912. IT-KoM 2026  
Two people next to an exhibition wall and behind a table with electronics and information material. Careers Fair for the Applied Computer Science Department at Erfurt University of Applied Sciences  
Event
  913. IT-KOM 2025  
Two people next to an exhibition wall and behind a table with electronics and information material. Contact fair of the Applied Computer Science department at the FH Erfurt University of Applied Sciences  
Event
  914. IT-KOM  
Two people next to an exhibition wall and behind a table with electronics and information material. Career Fair of the Applied Computer Science Department, University of Applied Sciences Erfurt  
Event
  915. ISSW 2026  
A circuit board with an unencapsulated microelectronic chip, leaving the bond wires and chip structures visible The International SPAD Sensor Workshop  
Event
  916. ISSW 2024  
Printed circuit board with microelectronic chip in a housing with microfluidic channels. The International SPAD Sensor Workshop & SPAD Sensor School  
Event
  917. ISSOM 2026  
International Summer School on Microelectronics 2026  
Event
  918. ISSOM 2025  
International Summer School on Microelectronics  
Event
  919. ISPS 2018  
Lecture: Thick Copper Re-Distribution Layer for Integrated High Voltage Transistors Authors: Ralf Lerner1, Klaus Heinrich1, Marco Erstling1, Peter Kornetzky2 1X-FAB Semiconductor Foundries GmbH, Erfurt, Germany 2IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ehrenbergstraße 27, 98693 Ilmenau, Germany  
Event
  920. ISMB 2014  
 
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