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821. Annual Report 2002

Annual report 2002 | IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH)

Reference

822. High-Frequency Performance of GaN High-Electron Mobility Transistors on 3C-SiC/Si Substrates With Au-Free Ohmic Contacts

Wael Jatal, Uwe Baumann Katja Tonisch Frank Schwierz Jörg Pezoldt Electron Device Letters, IEEE, Volume:36, Issue: 2, Page(s) 123-125, DOI: http://dx.doi.org/10.1109/LED.2014.2379664

Reference

823. S4ECoB

The embedded platform for acoustic signal processing being put into operation. Photograph: IMMS.

The embedded platform developed by IMMS processes acoustic signals and is part of a system that improves the energy-efficiency of public buildings.

Press release

824. Intelligent measuring clamp detects parasitic currents in industrial plant

In a project with its partner Indu-Sol, IMMS developed the intelligent measuring clamp 'EMCheck® ISMZ I'. Photograph: IMMS.

Presented by IMMS at the embedded world 2015, Hall 4, Booth 160 (OSADL joint booth).

Reference

825. MUSIK

IMMS investigated and modelled MEMS and BAW resonater characteristics to develop basic blocks for MEMS design. Photograph: IMMS.

IMMS has investigated, modelled and validated MEMS characteristics to develop basic blocks for a universally applicable method for MEMS design.

Reference

826. Integriertes elektrostatisches MEMS-Energy-Harvesting-Modul

Benjamin Saft, Fachzeitschrift Mechatronik 1-2, 2015

Reference

827. sMobiliTy

Installation of a wireless traffic sensor in Erfurt, Germany. Photograph: IMMS.

The wireless sensor system developed by IMMS to contribute to mobility with electric vehicles.

Reference

828. Vibration energy generators for low-frequency spectral excitations

Bianca Leistritz, Michael Katzschmann Hannes Toepfer EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers, in Procedia Engineering, Volume 87, 2014, Pages 420 – 423, http://www.sciencedirect.com, DOI: http://dx.doi.org/10.1016/j.proeng.2014.11.283

Reference

829. Perforated plates of inertial sensors – modeling by effective material properties

Steffen Michael, Astrid Frank G. Hölzer G. Lorenz EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers, in Procedia Engineering, Volume 87, 2014, Pages 480 – 483, http://www.sciencedirect.com, DOI: http://dx.doi.org/10.1016/j.proeng.2014.11.400

Reference

830. MEMS-T-Lab

In this test lab IMMS takes highly complex measurements of complete MEMS wafers at a new level of automation. Photograph: IMMS.

In the MEMS-T-Lab, IMMS takes highly complex semi-automated measurements for complete MEMS wafers