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Reference
  721. Power to the Model: Generating Energy-Aware Mixed-Signal Models using Machine Learning  
Martin Grabmann, Frank Feldhoff, Georg Gläser, Lausanne, Switzerland 2019 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Reference
  722. Modeling of Low-dropout Regulator to Optimize Power Supply Rejection in System-on-Chip Applications  
Jun Tan, Ralf Sommer, Lausanne, Switzerland 2019 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Reference
  723. Will There be Light? - Simulative Prediction of Fluorescence Measurements  
Florian Kögler, Alexander Hofmann, Georg Gläser, Lausanne, Switzerland 2019 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Reference
  724. Efficient Design and Layout of Capacitive 3D Accelerometer  
Steffen Michael, Ralf Sommer, Lausanne, Switzerland 2019 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Reference
  725. Analysis and Optimization of Power Supply Rejection for Power Management Unit Design in RFID Sensor applications  
Jun Tan, Ralf Sommer, Lausanne, Switzerland 2019 2019 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)  
Reference
  726. Design of a Capacitive Humidity Sensor Frontend with an Adaptive Resolution for Energy Autonomous Applications  
Maximilian Wiener, Benjamin Saft, Lausanne, Switzerland 2019 2019 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)  
Event
  727. SMACD + PRIME 2019  
5 lectures at the International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design and one lecture at the 15th Conference on PhD Research in Microelectronics and Electronics  
Reference
  728. A modular application specific active test environment for high-temperature wafertest up to 300 °C  
Michael Meister, Marco Reinhard, St. Anne’s College in the University of Oxford, Oxford, United Kingdom 2019 International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019)  
Reference
  729. Modular Desktop Platform for High-Temperature Characterization and Test up to 300°C  
Tom Reinhold, Björn Bieske, Georg Gläser, Michael Meister, St. Anne’s College in the University of Oxford, Oxford, United Kingdom 2019 International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019)  
Press release
  730. SONOTEC und IMMS belegen Platz 3 beim TÜV SÜD Innovationspreis 2019  
Auszeichnung für digitales mobiles Ultraschallprüfgerät SONAPHONE zur Instandhaltung 4.0.  
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