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  595. Parameter extraction such as layer thickness and stress at wafer level for process monitoring in semiconductor manufacturing  
Steffen Michael, Waldbronn, Germany 2026 Microstructure User Meeting 2026, Symposium zur optischen Schwingungsmessung  
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  596. PANDIA  
IMMS develops novel CMOS and SPAD sensor ICs for spectroradiometers for faster and more sensitive analysis of light  
Reference
  597. Ovutinin  
For an innovative rapid test for fertility diagnostics, IMMS is developing an image sensor for time-resolved fluorescence measurement.  
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  598. Out-of-Band Over-The-Air-Update for LoRaWAN-based Sensor Networks using BLE  
Florian Jung, Silvia Krug, Tino Hutschenreuther, Bologna, Italy 2025 2025 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor)  
Reference
  599. Out-of-Band Over-The-Air-Update for LoRaWAN-based Sensor Networks using BLE  
Florian Jung, Silvia Krug, Tino Hutschenreuther, Bologna, Italy 2025 2025 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor)  
About us
  600. Organisation  
Organigram of IMMS. Photograph: Kvalifik, Unsplash. Organisation: Here you will find our organisation chart, information on the Institute’s management, our departments, our supervisory board and our scientific advisory board, as well as contact details.  
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