581. Parametric Measurement Unit and Pin Electronics for modular Mixed Signal Test Systems   A. Rolapp, R. Paris Chip, Packaging, Design, Simulation and Test - International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden  

  582. Parameteridentifikation von MEMS auf Wafer-Level mittels dynamischer Messungen   S. Michael, R. Paris S. Hering 6. ITG/GI/GMM-Workshop Multi-Nature Systems: Entwicklung von Systemen mit elektronischen und nichtelektronischen Komponenten, Februar 2007, Erfurt  

  583. Parameter Identification of Piezoelectric AlGaN/GaN Beam Resonators by Dynamic Measurements   St. Michael, K. Brueckner F. Niebelschuetz K. Tonisch C. Schäffel 10th EuroSimE 2009, 26.-28. April, Delft, Netherlands  

  584. Parameter Identification of MEMS Membrane and Beam Structures by Modal Analysis and Dynamic Measurements   St. Michael, ANSYS Conference & 27. CADFEM Users' Meeting, 18. - 20. November 2009, Leipzig  

  585. Parameter Identification of Membrane Structures - Chances and Limitations   S. Michael, SSI 2010 - MEMUNITY Workshop, 24.03.2010, Grenoble, France  

  586. Parameter extraction such as layer thickness and stress at wafer level for process monitoring in semiconductor manufacturing   , Microstructure User Meeting 2026, Symposium zur optischen Schwingungsmessung, 19. März 2026, Waldbronn, Germany  

  589. Out-of-Band Over-The-Air-Update for LoRaWAN-based Sensor Networks using BLE   Florian Jung, Silvia Krug Tino Hutschenreuther 2025 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor), October 28-30, 2025, Bologna, Italy, pp. 330-335, DOI: https://doi.org/10.1109/MetroAgriFor66923.2025.11512381  

  590. Out-of-Band Over-The-Air-Update for LoRaWAN-based Sensor Networks using BLE   Florian Jung, Silvia Krug Tino Hutschenreuther 2025 IEEE International Workshop on Metrology for Agriculture and Forestry (MetroAgriFor), October 28-30, 2025, Bologna, Italy