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Reference

581. Passive 350 GHz Video Imaging Systems for Security Apllications

E. Heinz, T. May D. Born G. Zieger S. Anders V. Zakosarenko H.-G. Meyer C. Schäffel Journal of Infrared, Millimeter and Terahertz Waves manuscript No., DOI: http://dx.doi.org/10.1007/s10762-015-0170-8, Online ISSN: 1866-6906, Print ISSN: 1866-6892, Volume 36, Number 7, July 2015

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582. Partners

Many partners from R&D projects also use our services and some we involve as innovative, certified manufacturing partners to cover the value chain up to series production. Photo (reticle for semiconductor manufacturing): X-FAB.

Partners: We involve innovative, certified manufacturing partners to cover the value chain in R&D projects. You will also find an overview of our project partners from science and industry and information on how you can become a partner.

Reference

583. Parasitic Symmetry at a Glance: Uncovering Mixed-Signal Layout Constraints

Georg Gläser, Benjamin Saft Ralf Sommer FAC 2017, Frontiers in Analog CAD, Frankfurt on the Main, Germany, 21-22 July 2017, pp. 1-6. URL: http://ieeexplore.ieee.org/document/8011279/

Reference

584. Parametric Measurement Unit und Pinelektronik für ein modulares Mixed Signal Testsystem

A. Rolapp, R. Paris 21. Workshop 'Testmethoden und Zuverlässigkeit von Schaltungen und Systemen' (TuZ 2009), Tagungsband S. 86, 15. - 17. Februar 2009, Bremen

Reference

585. Parametric Measurement Unit and Pin Electronics for modular Mixed Signal Test Systems

A. Rolapp, R. Paris Chip, Packaging, Design, Simulation and Test - International Conference, Workshop and Table-top Exhibition 'Semiconductor Conference Dresden 2009' (SCD 2009), 29. - 30. April 2009, Dresden

Reference

586. Parameteridentifikation von MEMS auf Wafer-Level mittels dynamischer Messungen

S. Michael, R. Paris S. Hering 6. ITG/GI/GMM-Workshop Multi-Nature Systems: Entwicklung von Systemen mit elektronischen und nichtelektronischen Komponenten, Februar 2007, Erfurt

Reference

587. Parameter Identification of Piezoelectric AlGaN/GaN Beam Resonators by Dynamic Measurements

St. Michael, K. Brueckner F. Niebelschuetz K. Tonisch C. Schäffel 10th EuroSimE 2009, 26.-28. April, Delft, Netherlands

Reference

588. Parameter Identification of MEMS Membrane and Beam Structures by Modal Analysis and Dynamic Measurements

St. Michael, ANSYS Conference & 27. CADFEM Users' Meeting, 18. - 20. November 2009, Leipzig

Reference

589. Parameter Identification of Membrane Structures - Chances and Limitations

S. Michael, SSI 2010 - MEMUNITY Workshop, 24.03.2010, Grenoble, France

Reference

590. Parameter extraction such as layer thickness and stress at wafer level for process monitoring in semiconductor manufacturing

, Microstructure User Meeting 2026, Symposium zur optischen Schwingungsmessung, 19. März 2026, Waldbronn, Germany